參數(shù)資料
型號(hào)： MCF5372
廠(chǎng)商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： Microprocessor Data Sheet
中文描述： 微處理器數(shù)據(jù)表
文件頁(yè)數(shù)： 15/42頁(yè)
文件大?。?/td> 787K
代理商： MCF5372
Preliminary Electrical Characteristics
MCF5373 ColdFire
Microprocessor Data Sheet, Rev. 0.3
Preliminary
Freescale Semiconductor
15
5.2
Thermal Characteristics
The average chip-junction temperature (T
J
) in
°
C can be obtained from:
Eqn. 1
Where:
T
A
= Ambient Temperature,
°
C
Q
JMA
= Package Thermal Resistance, Junction-to-Ambient,
°
C/W
P
D
= P
INT
+ P
I/O
P
INT
= I
DD
×
IV
DD
, Watts - Chip Internal Power
P
I/O
= Power Dissipation on Input and Output Pins — User Determined
5
Power supply must maintain regulation within operating EV
DD
range during instantaneous
and operating maximum current conditions. If positive injection current (V
in
> EV
DD
) is greater
than I
DD
, the injection current may flow out of EV
DD
and could result in external power supply
going out of regulation. Insure external EV
DD
load will shunt current greater than maximum
injection current. This will be the greatest risk when the MCU is not consuming power (ex; no
clock). Power supply must maintain regulation within operating EV
DD
range during
instantaneous and operating maximum current conditions.
Table 5. Thermal Characteristics
Characteristic
Symbol
256MBGA
196MBGA
160QFP
Unit
Junction to ambient, natural convection
Four layer board
(2s2p)
θ
JMA
26
1,2
NOTES:
1
θ
JMA
and
Ψ
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
θ
JmA
and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction
temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device
junction temperature specification can be verified by physical measurement in the customer’s system using the
Ψ
jt
parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.
2
Per JEDEC JESD51-6 with the board horizontal.
3
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
4
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
5
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written in conformance with Psi-JT.
32
1,2
40
1,2
°
C / W
Junction to ambient (@200 ft/min)
Four layer board
(2s2p)
θ
JMA
23
1,2
29
1,2
36
1,2
°
C / W
Junction to board
θ
JB
θ
JC
Ψ
jt
15
3
20
3
25
3
°
C / W
Junction to case
10
4
10
4
10
4
°
C / W
Junction to top of package
2
1,5
2
1,5
2
1,5
°
C / W
Maximum operating junction temperature
T
j
105
105
105
o
C
T
J
T
A
P
D
Θ
JMA
×
(
)
+
=
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