參數(shù)資料
型號(hào)： MCF52256VN80J
廠商： Freescale Semiconductor
文件頁數(shù)： 21/46頁
文件大?。?/td> 0K
描述： IC MCU 256KB FLASH 144MAPBGA
標(biāo)準(zhǔn)包裝： 160
系列： MCF5225x
核心處理器： Coldfire V2
芯體尺寸： 32-位
速度： 80MHz
連通性： CAN，EBI/EMI，以太網(wǎng)，I²C，QSPI，UART/USART，USB OTG
外圍設(shè)備： DMA，LVD，POR，PWM，WDT
輸入/輸出數(shù)： 96
程序存儲(chǔ)器容量： 256KB（256K x 8）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 32K x 8
電壓 - 電源 (Vcc/Vdd)： 3 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x12b
振蕩器型： 內(nèi)部
工作溫度： 0°C ~ 70°C
封裝/外殼： 144-LBGA
包裝： 托盤
Electrical Characteristics
MCF52259 ColdFire Microcontroller, Rev. 5
Freescale
28
2.4
Flash Memory Characteristics
The flash memory characteristics are shown in Table 9 and Table 10.
16 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
17 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
18 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
The average chip-junction temperature (TJ) in C can be obtained from:
(1)
Where:
TA
= ambient temperature,
C
JA
= package thermal resistance, junction-to-ambient,
C/W
PD
= PINT PI/O
PINT
= chip internal power, IDD VDD, W
PI/O
= power dissipation on input and output pins — user determined, W
For most applications PI/O PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is:
(2)
Solving equations 1 and 2 for K gives:
K = PD (TA + 273 C) + JMA PD
2 (3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for
any value of TA.
Table 9. SGFM Flash Program and Erase Characteristics
(VDD = 3.0 to 3.6 V)
Parameter
Symbol
Min
Typ
Max
Unit
System clock (read only)
fsys(R)
0—
66.67 or 801
1
Depending on packaging; see the orderable part number summary (Table 2).
MHz
System clock (program/erase)2
2 Refer to the flash memory section for more information (Section 2.4, “Flash Memory Characteristics”)
fsys(P/E)
0.15
—
66.67 or 801
MHz
Table 10. SGFM Flash Module Life Characteristics
(VDD = 3.0 to 3.6 V)
Parameter
Symbol
Value
Unit
Maximum number of guaranteed program/erase cycles1 before failure
1 A program/erase cycle is defined as switching the bits from 1
0 1.
P/E
10,0002
Cycles
Data retention at average operating temperature of 85
C
Retention
10
Years
TJ
TA
PD JMA
+
=
PD
KTJ 273C
+
=
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MCF52258AG80 功能描述:32位微控制器 - MCU KIRIN3 COLDFIRE V2 RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MCF52258AG80 制造商:Freescale Semiconductor 功能描述:IC 32BIT MCU COLDFIRE/68K 80MHZ LQFP-144
MCF52258CAG66 功能描述:32位微控制器 - MCU KIRIN3 COLDFIRE V2 RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
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