參數(shù)資料
型號： MCF52256VN80J
廠商： Freescale Semiconductor
文件頁數(shù)： 20/46頁
文件大?。?/td> 0K
描述： IC MCU 256KB FLASH 144MAPBGA
標(biāo)準(zhǔn)包裝： 160
系列： MCF5225x
核心處理器： Coldfire V2
芯體尺寸： 32-位
速度： 80MHz
連通性： CAN，EBI/EMI，以太網(wǎng)，I²C，QSPI，UART/USART，USB OTG
外圍設(shè)備： DMA，LVD，POR，PWM，WDT
輸入/輸出數(shù)： 96
程序存儲器容量： 256KB（256K x 8）
程序存儲器類型： 閃存
RAM 容量： 32K x 8
電壓 - 電源 (Vcc/Vdd)： 3 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x12b
振蕩器型： 內(nèi)部
工作溫度： 0°C ~ 70°C
封裝/外殼： 144-LBGA
包裝： 托盤
MCF52259 ColdFire Microcontroller, Rev. 5
Electrical Characteristics
Freescale
27
100 LQFP
Junction to ambient, natural convection
Single layer board (1s)
JA
C/W
Junction to ambient, natural convection
Four layer board (2s2p)
JA
C/W
Junction to ambient, (@200 ft/min)
Single layer board (1s)
JMA
C/W
Junction to ambient, (@200 ft/min)
Four layer board (2s2p)
JMA
C/W
Junction to board
—
JB
2516
C/W
Junction to case
—
JC
C/W
Junction to top of package
Natural convection
jt
C/W
Maximum operating junction temperature
—
Tj
105
oC
1
JA and jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
JA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
2 Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
3 Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
4 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
6 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
7
JA and jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
JA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
8 Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
9 Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
10 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
11 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
12 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
13
JA and jt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
JA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
14 Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
15 Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
Table 8. Thermal Characteristics (continued)
Characteristic
Symbol
Value
Unit
相關(guān)PDF資料
PDF描述
MCF52277CVM160J IC MCU V2 32BIT 196MAPBGA
MCF5251CVM140 IC MPU 32BIT 140MHZ 225-MAPBGA
MCF5253CVM140J IC MCU 2.1MIPS 140MHZ 225MAPBGA
MCF5270CVM150 IC MCU 32BIT 150MHZ 196-MAPBGA
MCF5272VF66J IC MCU 32BIT 66MHZ 196-MAPBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCF52258AG80 功能描述:32位微控制器 - MCU KIRIN3 COLDFIRE V2 RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MCF52258AG80 制造商:Freescale Semiconductor 功能描述:IC 32BIT MCU COLDFIRE/68K 80MHZ LQFP-144
MCF52258CAG66 功能描述:32位微控制器 - MCU KIRIN3 COLDFIRE V2 RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MCF52258CAG66 制造商:Freescale Semiconductor 功能描述:IC 32BIT MCU COLDFIRE/68K 66MHZ LQFP-144
MCF52258CVN66 功能描述:32位微控制器 - MCU 144 MAPBGA RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*