參數(shù)資料
型號: MC8641DHX1500NC
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: MICROPROCESSOR, CBGA1023
封裝: 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023
文件頁數(shù): 65/140頁
文件大小: 1484K
代理商: MC8641DHX1500NC
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 0
30
Freescale Semiconductor
Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management
8.2
FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI AC Timing
Specifications
The AC timing specifications for FIFO, GMII, MII, TBI, RGMII, RMII and RTBI are presented in this
section.
8.2.1
FIFO AC Specifications
The basis for the AC specifications for the eTSEC’s FIFO modes is the double data rate RGMII and RTBI
specifications, since they have similar performance and are described in a source-synchronous fashion like
FIFO modes. However, the FIFO interface provides deliberate skew between the transmitted data and
source clock in GMII fashion.
When the eTSEC is configured for FIFO modes, all clocks are supplied from external sources to the
relevant eTSEC interface. That is, the transmit clock must be applied to the eTSECn’s TSECn_TX_CLK,
while the receive clock must be applied to pin TSECn_RX_CLK. The eTSEC internally uses the transmit
clock to synchronously generate transmit data and outputs an echoed copy of the transmit clock back out
onto the TSECn_GTX_CLK pin (while transmit data appears on TSECn_TXD[7:0], for example). It is
intended that external receivers capture eTSEC transmit data using the clock on TSECn_GTX_CLK as a
source- synchronous timing reference. Typically, the clock edge that launched the data can be used, since
the clock is delayed by the eTSEC to allow acceptable set-up margin at the receiver. Note that there is
relationship between the maximum FIFO speed and the platform speed. For more information see
NOTE
The phase between the output clocks TSEC1_GTX_CLK and
TSEC2_GTX_CLK (ports 1 and 2) is no more than 100 ps. The phase
between the output clocks TSEC3_GTX_CLK and TSEC4_GTX_CLK
(ports 3 and 4) is no more than 100 ps.
A summary of the FIFO AC specifications appears in Table 26 and Table 27.
3
Note that the symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Table 1 and Table 2.
Table 26. FIFO Mode Transmit AC Timing Specification
At recommended operating conditions with L/TVDD of 3.3 V ± 5% and 2.5 V ± 5%.
Parameter/Condition
Symbol
Min
Typ
Max
Unit
TX_CLK, GTX_CLK clock period (GMII mode)
tFIT
7.0
8.0
100
ns
TX_CLK, GTX_CLK clock period (Encoded mode)
tFIT
5.3
8.0
100
ns
TX_CLK, GTX_CLK duty cycle
tFITH/tFIT
45
50
55
%
TX_CLK, GTX_CLK peak-to-peak jitter
tFITJ
——
250
ps
Rise time TX_CLK (20%–80%)
tFITR
0.75
ns
Fall time TX_CLK (80%–20%)
tFITF
0.75
ns
相關(guān)PDF資料
PDF描述
MC8641VU1000KC MICROPROCESSOR, CBGA1023
MC8641VU1250JC MICROPROCESSOR, CBGA1023
MC8641VU1250GB MICROPROCESSOR, CBGA1023
MC8641HX1333HC MICROPROCESSOR, CBGA1023
MC8641DVU1250JB MICROPROCESSOR, CBGA1023
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC8641DTHX1000G 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications Addendum for the MC8641xTxxnnnnxC Series
MC8641DTHX1000GC 功能描述:微處理器 - MPU G8,REV2.1 1.05V,-40/105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC8641DTHX1000H 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications Addendum for the MC8641xTxxnnnnxC Series
MC8641DTHX1000J 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications Addendum for the MC8641xTxxnnnnxC Series
MC8641DTHX1000N 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications Addendum for the MC8641xTxxnnnnxC Series