參數(shù)資料
型號： MC7457VG867NC
廠商： Freescale Semiconductor
文件頁數(shù)： 58/71頁
文件大小： 0K
描述： IC MPU RISC 867MHZ 483FCCBGA
標準包裝： 36
系列： MPC74xx
處理器類型： 32-位 MPC74xx PowerPC
速度： 867MHz
電壓： 1.1V
安裝類型： 表面貼裝
封裝/外殼： 483-BCBGA，F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝： 483-FCCBGA（29x29）
包裝： 托盤
System Design Information
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
61
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
9.8.1
Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 5, the intrinsic conduction thermal resistance
paths are as follows:
The die junction-to-case (actually top-of-die since silicon die is exposed) thermal resistance
The die junction-to-ball thermal resistance
Figure 28 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 28. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink attach
material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Because the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the
silicon may be neglected. Thus, the thermal interface material and the heat sink conduction/convective
thermal resistances are the dominant terms.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
相關(guān)PDF資料
PDF描述
ACB106DHBS-S621 EDGECARD 212POS DIP R/A .050 SLD
FMC36DRAI CONN EDGECARD 72POS R/A .100 SLD
FMC49DRXN CONN EDGECARD 98POS DIP .100 SLD
FMC49DRXH CONN EDGECARD 98POS DIP .100 SLD
ABB106DHAT-S621 CONN EDGECARD 212PS R/A .050 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC74A5-33SNTR 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel
MC74A5-50T 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel
MC74AC00 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:QUAD 2-INPUT NAND GATE
MC74AC00D 功能描述:邏輯門 2-6V Quad 2-Input RoHS:否 制造商:Texas Instruments 產(chǎn)品:OR 邏輯系列:LVC 柵極數(shù)量:2 線路數(shù)量（輸入/輸出）:2 / 1 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 傳播延遲時間:3.8 ns 電源電壓-最大:5.5 V 電源電壓-最小:1.65 V 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DCU-8 封裝:Reel
MC74AC00DG 功能描述:邏輯門 2-6V Quad 2-Input NAND RoHS:否 制造商:Texas Instruments 產(chǎn)品:OR 邏輯系列:LVC 柵極數(shù)量:2 線路數(shù)量（輸入/輸出）:2 / 1 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 傳播延遲時間:3.8 ns 電源電壓-最大:5.5 V 電源電壓-最小:1.65 V 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DCU-8 封裝:Reel
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*