- 您現在的位置：買賣IC網 > PDF目錄45250 > MC7457VG733NC (FREESCALE SEMICONDUCTOR INC) 32-BIT, 733 MHz, RISC PROCESSOR, CBGA483 PDF資料下載
參數資料
| 型號： | MC7457VG733NC |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 733 MHz, RISC PROCESSOR, CBGA483 |
| 封裝： | 29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-483 |
| 文件頁數： | 57/73頁 |
| 文件大?。?/td> | 1715K |
| 代理商： | MC7457VG733NC |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁當前第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 7
60
Freescale Semiconductor
System Design Information
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
9.8.1
Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 5, the intrinsic conduction thermal resistance
paths are as follows:
The die junction-to-case (actually top-of-die since silicon die is exposed) thermal resistance
The die junction-to-ball thermal resistance
Figure 28 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 28. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink attach
material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Because the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the
silicon may be neglected. Thus, the thermal interface material and the heat sink conduction/convective
thermal resistances are the dominant terms.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
相關PDF資料 |
PDF描述 |
|---|---|
| MC74ACT125DR2 | ACT SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14 |
| MC74AC125DR2 | AC SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14 |
| MC74ACT125DTR2 | ACT SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14 |
| MC74F243J | F/FAST SERIES, 4-BIT TRANSCEIVER, TRUE OUTPUT, CDIP14 |
| MC74F2968AJ | 256K X 1, DRAM CONTROLLER, CDIP48 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| MC7457VG867NC | 功能描述:微處理器 - MPU APOLO7 RV1.2 1.1V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MC74A5-33SNTR | 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel |
| MC74A5-50T | 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel |
| MC74AC00 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:QUAD 2-INPUT NAND GATE |
| MC74AC00D | 功能描述:邏輯門 2-6V Quad 2-Input RoHS:否 制造商:Texas Instruments 產品:OR 邏輯系列:LVC 柵極數量:2 線路數量（輸入/輸出）:2 / 1 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 傳播延遲時間:3.8 ns 電源電壓-最大:5.5 V 電源電壓-最小:1.65 V 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:DCU-8 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復。