example, assuming a " />
參數(shù)資料
型號(hào)： MC7457RX1000NC
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 61/71頁(yè)
文件大?。?/td> 0K
描述： IC MPU RISC 32BIT 483FCCBGA
標(biāo)準(zhǔn)包裝： 36
系列： MPC74xx
處理器類(lèi)型： 32-位 MPC74xx PowerPC
速度： 1.0GHz
電壓： 1.1V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 483-BCBGA，F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝： 483-FCCBGA（29x29）
包裝： 托盤(pán)
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
System Design Information
Freescale Semiconductor
64
example, assuming a Ta of 30°C, a Tr of 5°C, a CBGA package RθJC = 0.1, and a typical power
consumption (Pd) of 18.7 W, the following expression for Tj is obtained:
Die-junction temperature: Tj = 30°C + 5°C + (0.1°C/W + 1.5°C/W + θsa) × 18.7 W
For this example, a Rθsavalue of 2.1°C/W or less is required to maintain the die junction temperature below
the maximum value of Table 4.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
figure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat flow. The final die-junction
operating temperature is not only a function of the component-level thermal resistance, but the
system-level design and its operating conditions. In addition to the component's power consumption, a
number of factors affect the final operating die-junction temperature—airflow, board population (local
heat flux of adjacent components), heat sink efficiency, heat sink attach, heat sink placement, next-level
interconnect technology, system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection,
and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models
for the board, as well as system-level designs.
For system thermal modeling, the MPC7447 and MPC7457 thermal model is shown in Figure 30. Four
volumes will be used to represent this device. Two of the volumes, solder ball, and air and substrate, are
modeled using the package outline size of the package. The other two, die, and bump and underfill, have
the same size as the die. The silicon die should be modeled 9.64 × 11.0 × 0.74 mm with the heat source
applied as a uniform source at the bottom of the volume. The bump and underfill layer is modeled as 9.64 ×
11.0 × 0.069 mm (or as a collapsed volume) with orthotropic material properties: 0.6 W/(m K) in the
xy-plane and 2 W/(m K) in the direction of the z-axis. The substrate volume is 25 × 25 × 1.2 mm
(MPC7447) or 29 × 29 × 1.2 mm (MPC7457), and this volume has 18 W/(m K) isotropic conductivity.
The solder ball and air layer is modeled with the same horizontal dimensions as the substrate and is 0.9 mm
thick. It can also be modeled as a collapsed volume using orthotropic material properties: 0.034 W/(m
K) in the xy-plane direction and 3.8 W/(m K) in the direction of the z-axis.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC7457RX1200PB 制造商:Freescale Semiconductor 功能描述:A7, 1.35V +50MV/-30MV - Trays
MC7457RX1267LB 制造商:Freescale Semiconductor 功能描述:MPC74XX RISC 32-BIT 0.13UM 1.267GHZ 1.5V/1.8V/2.5V 483-PIN F - Trays
MC7457RX1267LC 功能描述:微處理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC7457RX1333PB 制造商:Freescale Semiconductor 功能描述:A7, 1.35V +50MV/-30MV - Trays
MC7457RX733NC 功能描述:IC MPU RISC 32BIT 483FCCBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類(lèi)型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類(lèi)型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤(pán)
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