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參數(shù)資料
| 型號： | MC7445ARX1000LG |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 英文描述： | RISC Microprocessor Hardware Specifications |
| 中文描述： | RISC微處理器硬件規(guī)格 |
| 文件頁數(shù)： | 59/64頁 |
| 文件大?。?/td> | 1127K |
| 代理商： | MC7445ARX1000LG |
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MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1
Freescale Semiconductor
59
Document Revision History
10 Document Revision History
Table 20
provides a revision history for this hardware specification.
Table 20. Document Revision History
Rev. No.
Substantive Change(s)
0
Initial release.
1
Updated for Rev F devices; information specific to Rev C devices is now documented in a separate part
number specifications; see
Section 11.2, “Part Numbers Not Fully Addressed by This Document,”
for
more information.
Removed 600 and 800 MHz speed grades.
Increased leakage current specifications in
Table 6
from 10 to 30 μA.
Changed core voltage to 1.3 V; all instances of V
DD
and AV
DD
updated.
Updated power consumption specifications in
Table 7
.
Reduced I/O power guidance in
Table 7
from <20% to <5%.
Added footnote 1 to
Figure 9
and
Figure 11
.
Removed CI and WT from Input Setup and Input Hold lists in
Table 10
; these are output-only signals.
Removed INT, HRESET, MCP, SRESET, and SMI from Input Setup and Input Hold lists in
Table 10
;
these are asynchronous inputs.
Added TT[0:3] to Input Setup, Input Hold, Output Valid, and Output Hold lists in
Table 10
; these were
mistakenly omitted in Rev 0.
Updated
Table 13
and
Table 14
to reflect new L3 AC timing in Rev F devices.
Corrected Note 10 in
Table 16
and
Table 17
; this is an event pin, not an enable pin.
Corrected entries for L3_ECHO_CLK[1,3] in
Table 17
; these are I/O pins, not input-only.
Added Note 16 to
Table 17
; all No Connect pins must be left unconnected.
Changed name of PLL_EXT to PLL_CFG[4] and updated all instances.
Updated
Table 18
to reflect PLL configuration settings for Rev F devices.
Added dimensions D2 and E3 to
Figure 20
.
Transposed dimensions D4 and E4 in
Figure 21
(dimensions were reversed).
Revised
Figure 24
and
Section 9.7, “JTAG Configuration Signals.”
Revised format of
Section 11.2, “Part Numbers Not Fully Addressed by This Document,”
and added
Table 23
through Table 26.
Revised
Section 9.8.3, “Heat Sink Selection Example,”
and added additional thermal modeling
information, including
Figure 28
.
Changed maximum heat sink clip spring force in
Section 9.8, “Thermal Management Information,”
from
5.5 lbs to 10 lbs.
Changed substrate marking for MPC7445 in
Figure 29
; all MPC744x device substrates are marked
MPC7440.
Changed substrate marking for MPC7455 in
Figure 29
; all MPC745x device substrates are marked
MPC7450.
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