參數(shù)資料
型號(hào)： MC7445ARX1000LG
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述： RISC Microprocessor Hardware Specifications
中文描述： RISC微處理器硬件規(guī)格
文件頁數(shù)： 57/64頁
文件大?。?/td> 1127K
代理商： MC7445ARX1000LG
MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1
Freescale Semiconductor
57
System Design Information
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
800-248-2481
888-642-7674
888-246-9050
The following section provides a heat sink selection example using one of the commercially available heat sinks.
9.8.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
T
j
= T
a
+ T
r
+ (R
θ
JC
+ R
θ
int
+ R
θ
sa
)
×
P
d
where:
T
j
is the die-junction temperature
T
a
is the inlet cabinet ambient temperature
T
r
is the air temperature rise within the computer cabinet
R
θ
JC
is the junction-to-case thermal resistance
R
θ
int
is the adhesive or interface material thermal resistance
R
θ
sa
is the heat sink base-to-ambient thermal resistance
P
d
is the power dissipated by the device
During operation, the die-junction temperatures (T
j
) should be maintained less than the value specified in
Table 4
.
The temperature of air cooling the component greatly depends on the ambient inlet air temperature and the air
temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (T
a
) may range from 30°
to 40°C. The air temperature rise within a cabinet (T
r
) may be in the range of 5° to 10°C. The thermal resistance of
the thermal interface material (R
θ
int
) is typically about 1.5°C/W. For example, assuming a T
a
of 30°C, a T
r
of 5°C,
a CBGA package R
θ
JC
= 0.1, and a typical power consumption (P
d
) of 15.0 W, the following expression for T
j
is
obtained:
Die-junction temperature:
T
j
= 30°C + 5°C + (0.1°C/W + 1.5°C/W + R
θ
sa
)
×
15 W
For this example, a R
θ
sa
value of 3.1°C/W or less is required to maintain the die-junction temperature below the
maximum value of
Table 4
.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure-of-merit
used for comparing the thermal performance of various microelectronic packaging technologies, one should
exercise caution when only using this metric in determining thermal management because no single parameter can
adequately describe three-dimensional heat flow. The final die-junction operating temperature is not only a function
of the component-level thermal resistance, but the system-level design and its operating conditions. In addition to
the component's power consumption, a number of factors affect the final operating die-junction
相關(guān)PDF資料
PDF描述
MC7447A PowerPC microprocessor
MC7447AHX1000NB PowerPC microprocessor
MC7447AHX1167NB PowerPC microprocessor
MC74F126J 4-Bit Buffer/Driver
MC74F126JD 4-Bit Buffer/Driver
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC7445ARX733LF 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications
MC7445ARX733LG 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications
MC7445ARX867LF 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications
MC7445ARX867LG 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications
MC7445ARX933LF 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*