參數(shù)資料
型號: MC68HRC705JP7CP
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP28
封裝: PLASTIC, DIP-28
文件頁數(shù): 67/164頁
文件大?。?/td> 1165K
代理商: MC68HRC705JP7CP
28-Pin Small Outline Integrated Circuit (Case 751F)
MC68HC705JJ7 MC68HC705JP7 Advance Information Data Sheet, Rev. 4.1
Freescale Semiconductor
159
16.5 28-Pin Small Outline Integrated Circuit (Case 751F)
16.6 20-Pin Windowed Ceramic Integrated Circuit (Case 732)
MIN
MAX
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
17.80
7.40
2.35
0.35
0.41
0.23
0.13
10.05
0.25
18.05
7.60
2.65
0.49
0.90
0.32
0.29
10.55
0.75
0.701
0.292
0.093
0.014
0.016
0.009
0.005
0.395
0.010
0.711
0.299
0.104
0.019
0.035
0.013
0.011
0.415
0.029
1.27 BSC
0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
-A-
-B-
114
15
28
-T-
C
SEATING
PLANE
0.010 (0.25)
B
M
M
J
-T-
K
26X
G
28X
D
14X
P
R X 45°
F
0.010 (0.25)
T A
B
M
S
NOTES:
1. LEADS WITHIN 0.010 DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
DIM
MIN
MAX
INCHES
A
0.940
0.990
B
0.260
0.295
C
0.150
0.200
D
0.015
0.022
F
0.055
0.065
G
0.100 BSC
H
0.020
0.050
J
0.008
0.012
K
0.125
0.160
L
0.300 BSC
M
0
15
N
0.010
0.040
__
A
20
110
11
B
F
C
SEATING
PLANE
D
H
G
K
N
J
M
L
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