參數(shù)資料
型號(hào): MC68360UMAD
廠商: Motorola, Inc.
英文描述: Errata and Added Information to MC68360 Quad Integrated Communication Controller User Manual Rev 1
中文描述: 勘誤表和新增的資料MC68360四綜合通信控制器用戶手冊(cè)修訂1
文件頁數(shù): 17/28頁
文件大?。?/td> 159K
代理商: MC68360UMAD
MOTOROLA
MC68360 USER’S MANUAL ERRATA
17
In MC68040 companion mode, the QUICC understands
MC68040-type bus cycles but cannot generate them. If the
QUICC becomes busmaster, e. g. for SDMA transfers, it will
drive normal MC68030-type bus cycles with TT1 becoming DS
again. This should normally be no problem since the MC68040
does not interpret these input signals, but external circuitry han-
dling these signals must be aware of this fact.
6. Error in Figure 9-8.
On page 9-33, Figure 9-8, the buffer between RESETH, RSTI, the pushbutton and
CONFIG2 should not have an inverting output; it should be a non-inverting buffer.
7. Error in Reset Strategy.
On Page 9-34, section 9.4.1.3, the first sentence “If a QUICC is configured to provide the
global chip select, it will also provide an internal power-on reset generation.” is not correct.
QUICC will provide internal power-on reset generation regardless of chip select
configuration.
8. Error in Caching Sample Code.
On Page 9-53, section 9.5.4, correct the following in the code sample:
a) ‘MOVE.L #$003FC020,D0’ should be changed to ‘MOVE.L #$003FC040,D0’.
b) ‘MOVE.L #$403FC010,D0’ should be changed to ‘MOVE.L #$403FC020,D0’.
9. Error in Figure 9-33. 1-Mbyte DRAM Bank—32 Bits Wide.
On Page 9-87, Figure 9-33, correct the following:
a) On the first MC74F157, B0-B3 should be connected to A11-A14, not A12-A15.
b) On the second MC74F157, B0-B3 should be connected to A15-A18, not A16-A19.
c) On the third MC74F157, A1 and B1 should be unused (unconnected).
d) On the third MC74F157, B0 should be connected to A19, not A20.
e) On the third MC74F157, Y1-Y3 should be unused (unconnected).
Section 10 – Electrical Characteristics
1. Missing Note on Maximum Ratings
On Page 10-1, the following note should be added to the maximum ratings figure:
3. The supply voltage V
cc
must start and restart from 0.0 V; otherwise, the 360 will not come
out of reset properly.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
相關(guān)PDF資料
PDF描述
MC68360CFE25 QUad Integrated Communications Controller Users Manual
MC68360CRC25 QUad Integrated Communications Controller Users Manual
MC68360FE25 QUad Integrated Communications Controller Users Manual
MC68360FE25V QUad Integrated Communications Controller Users Manual
MC68360FE33 QUad Integrated Communications Controller Users Manual
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC68360VR25L 功能描述:微處理器 - MPU QUICC SIM 4SCC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC68360VR25LR2 功能描述:微處理器 - MPU QUICC SIM 4SCC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC68360VR25VL 功能描述:微處理器 - MPU QUICC SIM 4SCC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC68360VR25VLR2 功能描述:微處理器 - MPU QUICC SIM 4SCC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC68360VR33L 功能描述:微處理器 - MPU QUICC SIM 4SCC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324