10-4
M68020 USERS MANUAL
MOTOROLA
MC68020 DC Electrical Characteristics
(VCC = 5.0 Vdc ± 5%; GND = 0 Vdc; Temperature within defined ranges)
Characteristics
Symbol
Min
Max
Unit
Input High Voltage
VIH
2.0
VCC
V
Input Low Voltage
VIL
GND
0.5
0.8
V
Input Leakage Current
GND
Vin VCC
BERR, BR, BGACK, CLK, IPL2IPL0,
AVEC,DSACK1, DSACK0, CDIS
HALT, RESET
Iin
1.0
20
1.0
20
mA
Hi-Z (Off-State) Leakage Current
@ 2.4 V/0.5 V
A31A0, AS, DBEN, DS, D31D0,
FC2FC0, R/W, RMC, SIZ1SIZ0
ITSI
20
mA
Output High Voltage
IOH = 400 mA
A31A0, AS, BG, D31D0, DBEN, DS, R/W,
ECS, IPEND, RMC, SIZ1SIZ0, FC2FC0
VOH
2.4
V
Output Low Voltage
IOL = 3.2 mA
IOL = 5.3 mA
IOL = 2.0 mA
IOL = 10.7 mA
A31A0, FC2FC0, SIZ1SIZ0, BG, D310
AS, DS, R/W, RMC, DBEN, IPEND,
ECS, OCS
HALT, RESET
VOL
0.5
V
Power Dissipation (TA = 0°C)
PD
2.0
W
Capacitance (see Note)
Vin = 0 V, TA = 25C, f = 1
MHz
Cin
20
pF
Load Capacitance
ECS, OCS
All Other
CL
50
130
pF
NOTE: Capacitance is periodically sampled rather than 100% tested.
10.2.2 MC68EC020 Thermal Characteristics and DC Electrical
Characteristics
MC68EC020 Thermal Resistance (
°C/W)
The following table provides thermal resistance characteristics for junction to ambient and
junction to case for the MC68EC020 packages with natural convection and no heatsink.
Characteristic Natural Convection and No Heatsink
qJA
qJC
Thermal Resistance
PPGA Package (RP Suffix)
PQFP Package (FG Suffix)
32
53
10
18
MC68EC020 PQFP Package
Table 10-4 provides typical and worst case thermal characteristics for the MC68EC020
PQFP package without a heatsink.
Table 10-4.
qJA vs. AirflowMC68EC020 PQFP Package
Airflow in Linear Feet/Minute
qJA
0
*
50
100
200
300
400
MaximumNo Heatsink
53
49
45
41
38
36
TypicalNo Heatsink
51
47
43
39
37
35
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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