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參數(shù)資料
| 型號(hào)： | MC33298P |
| 廠商： | MOTOROLA INC |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | OCTAL SERIAL SWITCH (SPI Input/Output) |
| 中文描述： | 1 A 8 CHANNEL, SIPO BASED PRPHL DRVR, PDIP20 |
| 封裝： | PLASTIC, DIP-20 |
| 文件頁數(shù)： | 3/24頁 |
| 文件大小： | 280K |
| 代理商： | MC33298P |
MC33298
3
MOTOROLA ANALOG IC DEVICE DATA
MAXIMUM RATINGS
(All voltages are with respect to ground, unless otherwise noted.)
Rating
Symbol
Value
Unit
Power Supply Voltage
Steady–State
Transient Conditions (Note1)
VPWR(sus)
VPWR(pk)
VDD
VIN
VOUT(off)
–1.5 to 26.5
–13 to 60
V
V
Logic Supply Voltage (Note 2)
– 0.3 to 7.0
V
Input Pin Voltage (Note 3)
– 0.3 to 7.0
V
Output Clamp Voltage (Note 4)
(2.0 mA
≤
Iout
≤
0.5 A)
V
50 to 75
Output Self–Limit Current
IOUT(lim)
IOUT(cont)
3.0 to 6.0
A
Continuous Per Output Current (Note 5)
1.0
A
ESD Voltage
Human Body Model (Note 6)
Machine Model (Note 7)
VESD1
VESD2
Eclamp
2000
200
V
V
Output Clamp Energy (Note 8)
Repetitive:
TJ = 25
°
C
TJ = 125
°
C
Non–Repetitive:
TJ = 25
°
C
TJ = 125
°
C
Recommended Frequency of SPI Operation (Note 9)
100
30
mJ
mJ
2.0
0.5
J
J
fSPI
Tstg
TC
TJ
PD
Tsolder
R
θ
JA
2.0
MHz
Storage Temperature
– 55 to +150
°
C
Operating Case Temperature
– 40 to +125
°
C
Operating Junction Temperature
– 40 to +150
°
C
Power Dissipation (TA = 25
°
C) (Note 10)
Soldering Temperature (for 10 seconds)
3.0
W
260
°
C
Thermal Resistance, Junction–to–Ambient (Note 11)
Plastic Package, Case 738:
All Outputs “On” (Note 12)
Single Output “On” (Note 13)
SOP–24 Package, Case 751E:
All Outputs “On” (Note 12)
Single Output (Note 13)
°
C/W
31
37
34
40
NOTES:
1. Transient capability with external 100
resistor connected in series with VPWR pin and supply.
2. Exceeding these limits may cause a malfunction or permanent damage to the device.
3. Exceeding voltage limits on SCLK, SI, CSB, SFPD, or Reset pins may cause permanent damage to
the device.
4. With output “off.”
5. Continuous output rating so long as maximum junction temperature is not exceeded. (See Figure 21 and
22 for more details).
6. ESD1 testing is performed in accordance with the Human Body Model (CZap = 100 pF, RZap = 1500
).
7. ESD2 testing is performed in accordance with the Machine Model (CZap = 100 pF, RZap = 0
).
8. Maximum output clamp energy capability at indicated Junction Temperature using single pulse method.
See Figure 19 for more details.
9. Guaranteed and production tested for 2.0 MHz SPI operation but has been demonstrated to operate to
8.5 MHz @ 25
°
C.
10. Maximum power dissipation at indicated junction temperature with no heat sink used. See Figures 20,
21, and 22 for more details.
11. See Figure 20 for Thermal Model.
12. Thermal resistance from Junction–to–Ambient with all outputs “on” and dissipating equal power.
13. Thermal resistance from Junction–to–Ambient with a single output “on.”
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