MC33260
http://onsemi.com
22
PACKAGE DIMENSIONS
SOIC- -8
CASE 751- -07
ISSUE AJ
SEATING
PLANE
1
4
5
8
N
J
X 45
_
K
NOTES:
1.  DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2.  CONTROLLING DIMENSION: MILLIMETER.
3.  DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4.  MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5.  DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6.  751- -01 THRU 751- -06 ARE OBSOLETE. NEW
STANDARD IS 751- -07.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN
MAX
MIN
MAX
INCHES
4.80
5.00    0.189
0.197
MILLIMETERS
B
3.80
4.00    0.150
0.157
C
1.35
1.75    0.053
0.069
D
0.33
0.51    0.013
0.020
G
1.27 BSC
0.050 BSC
H
0.10
0.25    0.004
0.010
J
0.19
0.25    0.007
0.010
K
0.40
1.27    0.016
0.050
M
0
8
0
8
N
0.25
0.50    0.010
0.020
S
5.80
6.20    0.228
0.244
- -X- -
- -Y- -
G
M
Y
M
0.25 (0.010)
- -Z- -
Y
M
0.25 (0.010)
Z
S
X
S
M
_
_
_
_
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
r
mm
inches
u
SCALE 6:1
*ForadditionalinformationonourPb- -Freestrategyandsoldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty,representation or guarantee regarding the suitability ofits products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
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MC33260/D
GreenLine is a trademark of Motorola, Inc.
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