參數(shù)資料
型號(hào): MC10H181L
廠商: MOTOROLA INC
元件分類: 通用總線功能
英文描述: 3.3V LDO + Dual Switch For USB Hubs, Active-Low Enables 8-MSOP-PowerPAD -40 to 85
中文描述: 10H SERIES, 4-BIT ARITHMETIC LOGIC UNIT, CDIP24
封裝: CERAMIC, DIP-24
文件頁(yè)數(shù): 4/5頁(yè)
文件大小: 158K
代理商: MC10H181L
MC10H181
MOTOROLA
MECL Data
DL122 — Rev 6
2–278
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
–N–
–M–
–L–
V
W
D
D
Y BRK
28
1
VIEW S
S
L–M
S
0.010 (0.250)
N
S
T
S
L–M
M
0.007 (0.180)
N
S
T
0.004 (0.100)
SEATING
G1
G
J
C
Z
R
E
A
S
L–M
M
0.007 (0.180)
N
S
T
–T–
B
S
L–M
S
0.010 (0.250)
N
S
T
S
L–M
M
0.007 (0.180)
N
S
T
U
S
L–M
M
0.007 (0.180)
N
S
T
Z
G1
X
VIEW D–D
S
L–M
M
0.007 (0.180)
N
S
T
K1
VIEW S
H
K
F
S
L–M
M
0.007 (0.180)
N
S
T
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN
0.485
0.485
0.165
0.090
0.013
0.050 BSC
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
–––
2
0.410
0.040
MAX
0.495
0.495
0.180
0.110
0.019
MIN
12.32
12.32
4.20
2.29
0.33
MAX
12.57
12.57
4.57
2.79
0.48
MILLIMETERS
INCHES
1.27 BSC
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
–––
2
10.42
1.02
0.032
–––
–––
0.456
0.456
0.048
0.048
0.056
0.020
10
0.430
–––
0.81
–––
–––
11.58
11.58
1.21
1.21
1.42
0.50
10
10.92
–––
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參數(shù)描述
MC10H181P 制造商:Motorola Inc 功能描述:
MC10H186FN 功能描述:觸發(fā)器 Hexadecimal D-Type RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel
MC10H186FNG 功能描述:觸發(fā)器 Hexadecimal D-Type Master-Slave w/Reset RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel
MC10H186FNR2 功能描述:觸發(fā)器 Hexadecimal D-Type RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel
MC10H186FNR2G 功能描述:觸發(fā)器 Hexadecimal D-Type Master-Slave w/Reset RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel