參數(shù)資料
型號(hào)： MAX9796EBX+TG45
廠商： Maxim Integrated Products
文件頁(yè)數(shù)： 19/28頁(yè)
文件大?。?/td> 0K
描述： IC AMP AUDIO 2.3W MONO D 36UCSP
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 2,500
系列： DirectDrive®
類(lèi)型： D 類(lèi)
輸出類(lèi)型： 1-通道（單聲道），帶立體聲耳機(jī)
在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量： 2.3W x 1 @ 4 歐姆
電源電壓： 2.7 V ~ 5.5 V
特點(diǎn)： 消除爆音，差分輸入，I²C，靜音，短路和熱保護(hù)，關(guān)機(jī)，音量控制
安裝類(lèi)型： 表面貼裝
供應(yīng)商設(shè)備封裝： 36-UCSP
封裝/外殼： 36-WFBGA，CSBGA
包裝： 帶卷 (TR)
Chip Information
PROCESS: BiCMOS
MAX9796
Charge-Pump Capacitor Selection
Use capacitors with an ESR less than 100mΩ for opti-
mum performance. Low-ESR ceramic capacitors mini-
mize the output resistance of the charge pump. Most
surface-mount ceramic capacitors satisfy the ESR
requirement. For best performance over the extended
temperature range, select capacitors with an X7R dielec-
tric or better. Table 12 lists suggested manufacturers.
Flying Capacitor (C1)
The value of the flying capacitor (C1) affects the output
resistance of the charge pump. A C1 value that is too
small degrades the device’s ability to provide sufficient
current drive, which leads to a loss of output voltage.
Increasing the value of C1 reduces the charge-pump out-
put resistance to an extent. Above 1F, the on-resistance
of the switches and the ESR of C1 and C2 dominate.
Output Capacitor (C2)
The output capacitor value and ESR directly affect the
ripple at CPVSS. Increasing the value of C2 reduces
output ripple. Likewise, decreasing the ESR of C2
reduces both ripple and output resistance. Lower
capacitance values can be used in systems with low
maximum output power levels. See the Output Power
vs. Load Resistance and Charge-Pump Capacitor Size
graph in the
Typical Operating Characteristics.
CPVDD Bypass Capacitor (C3)
The CPVDD bypass capacitor (C3) lowers the output
impedance of the power supply and reduces the
impact of the MAX9796’s charge-pump switching tran-
sients. Bypass CPVDD with C3 to PGND and place it
physically close to the CPVDD and PGND. Use a value
for C3 that is equal to C1.
Supply Bypassing, Layout, and Grounding
Proper layout and grounding are essential for optimum
performance. Use large traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance. Large traces also aid in mov-
ing heat away from the package. Proper grounding
improves audio performance, minimizes crosstalk
between channels, and prevents any switching noise
from coupling into the audio signal. Connect PGND and
GND together at a single point on the PCB. Route all
traces that carry switching transients away from GND
and the traces/components in the audio signal path.
Connect all of the power-supply inputs (CPVDD, VDD,
and PVDD) together. Bypass CPVDD with a 1F capaci-
tor to CPGND. Bypass VDD with a 1F capacitor to
GND. Bypass PVDD with a 1F capacitor in parallel with
a 0.1F capacitor to PGND. Place the bypass capaci-
tors as close as possible to the MAX9796. Place a bulk
capacitor between PVDD and PGND, if needed.
Use large, low-resistance output traces. Current drawn
from the outputs increase as load impedance decreas-
es. High output trace resistance decreases the power
delivered to the load. Large output, supply, and GND
traces allow more heat to move from the MAX9796 to the
PCB, decreasing the thermal impedance of the circuit.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profile, as well as the latest information of reliability
testing results, refer to Application Note: UCSP—A
Wafer-Level Chip-Scale Package available on Maxim’s
website at www.maxim-ic.com/ucsp.
UCSP Thermal Consideration
When operating at maximum output power, the UCSP
thermal dissipation can become a limiting factor. The
UCSP package does not dissipate heat as efficiently as
packages with a thermal pad. As a result, in some
applications, the thermal performance of the package
may limit performance.
2.3W, High-Power Class D Audio Subsystem
with DirectDrive Headphone Amplifiers
26
______________________________________________________________________________________
SUPPLIER
PHONE
FAX
WEBSITE
Taiyo Yuden
800-348-2496
847-925-0899
www.t-yuden.com
TDK
847-803-6100
847-390-4405
www.component.tdk.com
Table 12. Suggested Capacitor Manufacturers
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MAX9796EVKIT 制造商:Maxim Integrated Products 功能描述:2.3W HIGH-POWER CLASS D AUDIO SUBS - Rail/Tube
MAX9796EVKIT+ 制造商:Maxim Integrated Products 功能描述:MAX9796 EVAL KIT - Boxed Product (Development Kits)
MAX98088EVKIT# 功能描述:音頻 IC 開(kāi)發(fā)工具 MAX98088 Eval Kit RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類(lèi)型:Audio Amplifiers 工具用于評(píng)估:TAS5614L 工作電源電壓:12 V to 38 V
MAX98088EVKIT+ 功能描述:音頻 IC 開(kāi)發(fā)工具 MAX98088 Eval Kit RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類(lèi)型:Audio Amplifiers 工具用于評(píng)估:TAS5614L 工作電源電壓:12 V to 38 V
MAX98088EWY+T 功能描述:接口—CODEC Dual I2S Codec RoHS:否 制造商:Texas Instruments 類(lèi)型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類(lèi)型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel
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