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參數(shù)資料
| 型號： | MADP-030025-1314G |
| 元件分類： | PIN二極管 |
| 英文描述： | SILICON, PIN DIODE |
| 封裝： | ROHS COMPLIANT, GLASS, CASE 1314, 2 PIN |
| 文件頁數(shù)： | 4/5頁 |
| 文件大小： | 203K |
| 代理商： | MADP-030025-1314G |
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
SURMOUNT 25μM PIN Diodes
RoHS Compliant
M/A-COM Products
Rev 4
MADP-017025-1314
MADP-030025-1314
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
Assembly Guidelines
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder or conductive epoxy attachment onto hard and soft substrates. The use
of 60/40, Pb/Sn,
80/20, Au/Sn or any other lead-free solder is recommended to achieve the lowest series
resistance and optimum heat sink.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a
vacuum tip and applying a force of 40 - 60 grams to the top surface of the device. When soldering, position the die
so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the
circuit trace near the mounting pads while applying 40 to 60 grams of force perpendicular to the top surface of the
die. Both mounting pads should be heated simultaneously so that the solder under both pads flows at the same
time. The solder joint should not be made one at a time. By doing so, would create an un-equal heat flow and
potentially create thermal stress to the chip.
Solder reflow should not be performed by causing heat to flow through the top surface of the die. Die should be
uniformly heated in a re-flow oven. Proper flow is easily determined looking down from the top since the HMIC
glass is transparent and the edges of the mounting pads can be visually inspected through the die after
attachment is complete. A typical soldering process profile and handling instructions are provided in
Application Notes, M538 Surface Mounting Instructions and M541 Bonding and Handling Procedures on the
MA-COM website at www.macom.com.
Conductive silver epoxy may also be used for die attachment, in lower Incident power applications where the
average power is < 1 W. Apply a thin controlled amount approximately 1- 2 mils thick to minimize ohmic and
thermal stresses. Take care not to bridge the gap between the chip pads with epoxy. A thin epoxy fillet should be
visible around the perimeter of the pads after placement to ensure full coverage. Cure per epoxy per
manufacturer’s recommended schedule.
Gel Pack
MADP-017025-13140G
MADP-030025-13140G
Ordering Information
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