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參數(shù)資料
| 型號： | MADP-007224-01072T |
| 元件分類： | PIN二極管 |
| 英文描述： | SILICON, PIN DIODE |
| 封裝： | ROHS COMPLIANT, HERMETIC SEALED, CERAMIC, LEADLESS, MELF-2 |
| 文件頁數(shù)： | 1/2頁 |
| 文件大?。?/td> | 264K |
| 代理商： | MADP-007224-01072T |
Features
Rectangular MELF SMQ
Hermetically Sealed
Low Loss
Low Distortion
High Isolation
Passivated PIN Diode Chips
Full Face Bonds
Ultra Low Non-Magnetic Packages
Suitable for MRI Applications
High Power Handling Capability
Description
The MADP-007224-01072T is a square, surface mountable, PIN diode in a metal electrode leadless faced (MELF)
package. It utilizes M/A-COM’s HIPAX technology to produce a low inductance ceramic package with no ribbons or
whisker wires. The package is hermetically sealed at temperatures exceeding 300°C and is plated using M/A-COM’s new
ultra low magnetic plating process. The end result is a package with extremely low magnetic permeability. Incorporated in
the package is a passivated PIN diode chip that is full face bonded to refractory metal pins on both the cathode and anode
of the chip. The end product is a device which has a very low resistance, low loss and high power handling capability. The
mechanical and electrical properties of these devices make them ideally suited for MRI transmitters, receivers and surface
coils. The MADP-007224-01072 has been comprehensively characterized both electrically and mechanically to ensure
predictable performance.
Applications
The diodes are designed specifically for use as a low loss, low distortion, high power switching element in a high magnetic
field at HF and UHF frequencies. Its high power rating provides superior performance at high RF power levels and is
designed to meet the most stringent electrical and mechanical requirements of MRI equipment.
Designed for Automated Assembly
These SMQ PIN diodes are designed for high volume tape and reel assembly. The rectangular package design makes
automatic pick and place, indexing and assembly extremely easy. The parallel flat surfaces are suitable for key jaw or
vacuum pickup techniques. All solderable surfaces are tin plated and compatible with reflow and vapor phase RoHS
soldering methods.
RoHS Statement
The MADP-007224-01072T is RoHS compliant, meaning it does not contain the maximum concentration of 0.1% by
weight in homogenous materials for lead, hex chrome, mercury, PBB, PBDE, and 0.01% for cadmium.
Environmental Capability
The MADP-007224-01072T devices are capable of meeting the environmental and mechanical requirements set forth in
MIL-STD-750, MIL-STD-202 as well as other military standards. The table below lists some of the typical MIL-STD 750
tests the device is designed to meet.
MIL-STD-750
Test
Method
Description
High Temp. Storage
1031
+175C, 250 Hours
Temp. Shock
1051
-65C to +175C 20 Cycles
HTRB
1038
80% of rated VB, +150C, 96 Hours
Moisture Resistance
1021
Fine Leak
1071 Cond. H
1 X 10-7 CC/Sec
Constant Acceleration
2006
20,000 G's
Vibration Fatigue
2046
20,000 G's
Solderability
2026
MADP-007224-01072T
Non Magnetic MELF PIN Diode
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| MADP-007433-0287DT | 功能描述:PIN 二極管 Ls = 1.4nH SOT-23 Series Tee Reverse RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向電壓:200 V 正向連續(xù)電流: 頻率范圍:10 MHz to 6 GHz 端接類型:SMD/SMT 封裝 / 箱體:QFN-3 封裝:Reel |
| MADP007436/1279 | 制造商:M/A-COM Technology Solutions 功能描述:RF PIN DIODE |
| MADP007436-1279 | 制造商:M/A-COM Technology Solutions 功能描述:RF PIN DIODE |
| MADP-007437-028 | 制造商:M/A-COM Technology Solutions 功能描述:RF PIN DIODE |
| MADP-007437-0287DT | 制造商:M/A-COM Technology Solutions 功能描述:- Tape and Reel |
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