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參數(shù)資料
| 型號(hào)： | MAAPGM0069-DIE |
| 英文描述： | Amplifier, Power, 2W 7.1-11.7 GHz |
| 中文描述： | 放大器，電源，2W的7月1號(hào)至11月7日吉赫 |
| 文件頁數(shù)： | 8/8頁 |
| 文件大小： | 403K |
| 代理商： | MAAPGM0069-DIE |
Amplifier, Power, 2W
7.1-11.7 GHz
MAAPGM0069-DIE
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
North America
Tel: 800.366.2266 / Fax: 978.366.2266
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com
for additional data sheets and product information.
Rev B
Preliminary Datasheet
8
Figure 23. Recommended operational configuration. Wire bond as shown
.
Die Handling:
Refer to Application Note AN3016.
Assembly and Bonding Diagram
100 pF
RF
OUT
RF
IN
100 pF
V
GG
0.1
μ
F
100
Ω
100 pF
100 pF
V
DD
0.1
μ
F
Assembly Instructions:
Die Attach:
Use AuSn (80/20) 1 mil. preform solder. Limit time @ 310 °C to less than
7 minutes. Refer to Application Note AN3017 for more detailed information.
Wirebonding:
Bond @ 160 °C using standard ball or thermal compression wedge
bond techniques. For DC pad connections, use either ball or wedge bonds. For best
RF performance, use wedge bonds of shortest length, although ball bonds are also
acceptable.
Biasing Note: Must apply negative bias to V
GG
before applying positive bias to V
DD
to prevent
damage to amplifier.
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| MAAPGM0070 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:Amplifier, Power, 1.9W 10.0-13.25 GHz |
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| MAAPGM0071 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:Amplifier, Power, 1.6W 12.75-15.35 GHz |
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| MAAPGM0072 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:Amplifier, Power, 1 W 17.7-19.7 GHz |
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