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參數(shù)資料
| 型號(hào)： | M38037M8H-XXXWG |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 8-BIT, MROM, 8.4 MHz, MICROCONTROLLER, PBGA64 |
| 封裝： | 6 X 6 MM, 0.65 MM PITCH, PLASTIC, FLGA-64 |
| 文件頁(yè)數(shù)： | 99/111頁(yè) |
| 文件大?。?/td> | 1205K |
| 代理商： | M38037M8H-XXXWG |
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Rev.3.02
Nov 05, 2004
page 88 of 108
3803 Group (Spec. H)
PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change.
NOTES ON USAGE
Handling of Power Source Pins
In order to avoid a latch-up occurrence, connect a capacitor suit-
able for high frequencies as bypass capacitor between power
source pin (VCC pin) and GND pin (VSS pin), and between power
source pin (VCC pin) and analog power source input pin (AVSS
pin). Besides, connect the capacitor to as close as possible. For
bypass capacitor which should not be located too far from the pins
to be connected, a ceramic capacitor of 0.01
F–0.1 F is recom-
mended.
Power Source Voltage
When the power source voltage value of a microcomputer is less
than the value which is indicated as the recommended operating
conditions, the microcomputer does not operate normally and may
perform unstable operation.
In a system where the power source voltage drops slowly when
the power source voltage drops or the power supply is turned off,
reset a microcomputer when the power source voltage is less than
the recommended operating conditions and design a system not
to cause errors to the system by this unstable operation.
Flash Memory Version
The CNVss pin determines the flash memory mode. To improve
the noise reduction, connect a track between CNVss pin and Vss
pin or Vcc pin with 1 to 10 k
resistance. The mask ROM version
track of CNVss pin has no operational interference even if it is
connected to Vss pin or Vcc pin via a resistor.
Electric Characteristic Differences Between
Mask ROM and Flash Memory Version MCUs
There are differences in electric characteristics, operation margin,
noise immunity, and noise radiation between Mask ROM and
Flash Memory version MCUs due to the difference in the manufac-
turing processes, built-in ROM, and layout pattern etc.When
manufacturing an application system with the Flash Memory ver-
sion and then switching to use of the Mask ROM version, please
conduct evaluations equivalent to the system evaluations con-
ducted for the flash memory version.
DATA REQUIRED FOR MASK ORDERS
The following are necessary when ordering a mask ROM produc-
tion:
1.Mask ROM Confirmation Form
2.Mark Specification Form
3.Data to be written to ROM, in EPROM form (three identical cop-
ies)
For the mask ROM confirmation and the mark specifications,
refer to the “Renesas Technology Corp.” Homepage
(http://www.renesas.com/en/rom).
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| M38039FFHFP#U0 | 功能描述:IC 740 MCU FLASH 60K 64QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:740/38000 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲(chǔ)器容量:384KB（384K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤(pán) 產(chǎn)品目錄頁(yè)面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
| M38039FFHHP | 功能描述:MCU 3/5V 56K+4K 64-LQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:740/38000 標(biāo)準(zhǔn)包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN，SCI，SPI 外圍設(shè)備:POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):21 程序存儲(chǔ)器容量:40KB（20K x 16） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 6x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤(pán) 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323 |
| M38039FFH-HP#U | 制造商:Renesas Electronics Corporation 功能描述:8BIT 740 CISC 56KB FLASH 16.8MHZ 3.3/5V - Trays |
| M38039FFHHP#U0 | 功能描述:MCU 3/5V 56K+4K PB-FREE 64-LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:740/38000 標(biāo)準(zhǔn)包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN，SCI，SPI 外圍設(shè)備:POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):21 程序存儲(chǔ)器容量:40KB（20K x 16） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 6x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤(pán) 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323 |
| M38039FFHKP#U0 | 制造商:Renesas Electronics Corporation 功能描述:MCU 3/5V 56K+4K PB-FREE 64-LQFP - Trays |
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