參數(shù)資料
型號(hào): M25PE40
廠商: 意法半導(dǎo)體
元件分類: DRAM
英文描述: 4 Mbit Uniform Sector, Serial Flash Memory
中文描述: 4兆位統(tǒng)一部門,串行閃存
文件頁數(shù): 39/60頁
文件大?。?/td> 315K
代理商: M25PE40
M25PE40
Instructions
39/60
6.15
Bulk Erase (BE)
Note:
The Bulk Erase (BE) instruction is decoded only in the in the T9HX process (see
Important
note on page 6
).
The Bulk Erase (BE) instruction sets all bits to 1 (FFh). Before it can be accepted, a Write
Enable (WREN) instruction must previously have been executed. After the Write Enable
(WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).
The Bulk Erase (BE) instruction is entered by driving Chip Select (S) Low, followed by the
instruction code on Serial Data Input (D). Chip Select (S) must be driven Low for the entire
duration of the sequence.
The instruction sequence is shown in
Figure 21
.
Chip Select (S) must be driven High after the eighth bit of the instruction code has been
latched in, otherwise the Bulk Erase instruction is not executed. As soon as Chip Select (S)
is driven High, the self-timed Bulk Erase cycle (whose duration is t
BE
) is initiated. While the
Bulk Erase cycle is in progress, the Status Register may be read to check the value of the
Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Bulk
Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is
completed, the Write Enable Latch (WEL) bit is reset.
Any Bulk Erase (BE) instruction, while an Erase, Program or Write cycle is in progress, is
rejected without having any effects on the cycle that is in progress. A Bulk Erase (BE)
instruction is ignored if at least one sector or subsector is write-protected (Hardware or
Software protection).
If Reset (Reset) is driven Low while a Bulk Erase (BE) cycle is in progress, the Bulk Erase
cycle is interrupted and data may not be erased correctly (see
Table 12: Device status after
a Reset Low pulse
). On Reset going Low, the device enters the Reset mode and a time of
t
RHSL
is then required before the device can be re-selected by driving Chip Select (S) Low.
For the value of t
RHSL
see
Table 22: Timings after a Reset Low pulse
in
Section 11: DC and
AC parameters
.
Figure 21.
Bulk Erase (BE) instruction sequence
C
D
AI03752D
S
2
1
3
4
5
6
7
0
Instruction
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