5-4 Revision 13 Revision Changes Page Revision 9 (Aug 2009) Product Brief v1.2 All references to speed grade –F have been re" />
參數(shù)資料
型號： M1A3PE3000L-PQ208
廠商： Microsemi SoC
文件頁數(shù)： 62/162頁
文件大?。?/td> 0K
描述： IC FPGA 1KB FLASH 3M 208-PQFP
標準包裝： 24
系列： ProASIC3EL
RAM 位總計： 516096
輸入/輸出數(shù)： 147
門數(shù)： 3000000
電源電壓： 1.14V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 208-BFQFP
供應商設(shè)備封裝： 208-PQFP（28x28）
Datasheet Information
5-4
Revision 13
Revision
Changes
Page
Revision 9 (Aug 2009)
Product Brief v1.2
All references to speed grade –F have been removed from this document.
N/A
definitions of hot-swap and cold-sparing.
DC
and
Switching
Characteristics v1.3
3.3 V LVCMOS and 1.2 V LVCMOS Wide Range support was added to the
datasheet. This affects all tables that contained 3.3 V LVCMOS and 1.2 V
LVCMOS data.
N/A
IIL and IIH input leakage current information was added to all "Minimum and
Maximum DC Input and Output Levels" tables.
N/A
–F was removed from the datasheet. The speed grade is no longer supported.
N/A
voltage" and note 4 are new.
table was updated.
There are new parameters and data was updated in the Table 2-99 RAM4K9
table.
There are new parameters and data was updated in the Table 2-100
Revision 8 (Feb 2008)
Product Brief v1.1
Revision 7 (Jun 2008)
DC
and
Switching
Characteristics v1.2
remove "as measured on quiet I/Os." Table note 2 was revised to remove
"estimated SSO density over cycles." Table note 3 was deleted
.
updated.
Revision 6 (Jun 2008) The A3PE600 "FG484" table was missing G22. The pin and its function were
added to the table.
Revision 5 (Jun 2008)
Packaging v1.4
The naming conventions changed for the following pins in the "FG484" for the
A3PE600:
Pin Number
New Function Name
J19
IO45PPB2V1
K20
IO45NPB2V1
M2
IO114NPB6V1
N1
IO114PPB6V1
N4
GFC2/IO115PPB6V1
P3
IO115NPB6V1
Revision 4 (Apr 2008)
Product Brief v1.0
The product brief portion of the datasheet was divided into two sections and given
a version number, starting at v1.0. The first section of the document includes
features, benefits, ordering information, and temperature and speed grade
offerings. The second section is a device family overview.
N/A
Packaging v1.3
The "FG324" package diagram was replaced.
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參數(shù)描述
M1A3PE3000L-PQ208I 功能描述:IC FPGA 1KB FLASH 3M 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3EL 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應商設(shè)備封裝:352-CQFP（75x75）
M1A3PE3000L-PQG144M 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:Military ProASIC3/EL Low-Power Flash FPGAs
M1A3PE3000L-PQG208 功能描述:IC FPGA 1KB FLASH 3M 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3EL 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設(shè)備封裝:484-FBGA（23x23）
M1A3PE3000L-PQG208I 功能描述:IC FPGA 1KB FLASH 3M 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3EL 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應商設(shè)備封裝:352-CQFP（75x75）
M1A3PE3000-PQ208 功能描述:IC FPGA 1KB FLASH 3M 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3E 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設(shè)備封裝:484-FBGA（23x23）
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