- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄4384 > M1A3PE3000L-PQ208 (Microsemi SoC)IC FPGA 1KB FLASH 3M 208-PQFP PDF資料下載
參數(shù)資料
| 型號(hào)： | M1A3PE3000L-PQ208 |
| 廠商： | Microsemi SoC |
| 文件頁(yè)數(shù)： | 60/162頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA 1KB FLASH 3M 208-PQFP |
| 標(biāo)準(zhǔn)包裝： | 24 |
| 系列： | ProASIC3EL |
| RAM 位總計(jì)： | 516096 |
| 輸入/輸出數(shù)： | 147 |
| 門(mén)數(shù)： | 3000000 |
| 電源電壓： | 1.14V ~ 1.575 V |
| 安裝類(lèi)型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 208-BFQFP |
| 供應(yīng)商設(shè)備封裝： | 208-PQFP（28x28） |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)當(dāng)前第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)
Datasheet Information
5-2
Revision 13
Revision 11
(continued)
Figure 2-11 AC Loading was updated to match tables in the "Summary of I/O
In Table 2-81 Minimum and Maximum DC Input and Output Levels, VIL and VIH
were revised so that the maximum is 3.6 V for all listed values of VCCI (SAR
37222).
Figure 2-47 FIFO Read and Figure 2-48 FIFO Write are new (SAR 34848).
The following sentence was removed from the "VMVx I/O Supply Voltage (quiet)"
section in the "Pin Descriptions and Packaging" chapter: "Within the package, the
VMV plane is decoupled from the simultaneous switching noise originating from
the output buffer VCCI domain" and replaced with “Within the package, the VMV
plane biases the input stage of the I/Os in the I/O banks” (SAR 38322). The
datasheet mentions that "VMV pins must be connected to the corresponding
VCCI pins" for an ESD enhancement.
Revision 10
(March 2012)
were revised to clarify that although no existing security measures can give an
absolute guarantee, Microsemi FPGAs implement the best security available in
the industry (SAR 34669).
The Y security option and Licensed DPA Logo were added to the "ProASIC3E
Ordering Information" section. The trademarked Licensed DPA Logo identifies
that a product is covered by a DPA counter-measures license from Cryptography
Research (SAR 34727).
The following sentence was removed from the "Advanced Architecture" section:
"In addition, extensive on-chip programming circuitry allows for rapid, single-
voltage (3.3 V) programming of IGLOOe devices via an IEEE 1532 JTAG
interface" (SAR 34689).
The "Specifying I/O States During Programming" section is new (SAR 34699).
VCCPLL in Table 2-2 Recommended Operating Conditions 1 was corrected
from "1.4 to 1.6 V" to "1.425 to 1.575 V" (SAR 33851).
The TJ symbol was added to the table and notes regarding TA and TJ were
removed. The second of two parameters in the VCCI and VMV row, called "3.3 V
DC supply voltage," was corrected to "3.0 V DC supply voltage" (SAR 37227).
The reference to guidelines for global spines and VersaTile rows, given in the
"Global Clock Contribution—PCLOCK" section, was corrected to t
he "Spine
Architecture" section of the Global Resources chapter in the ProASIC3E
FPGA Fabric User's Guide (SAR 34735).
(example) (SAR 37109).
The typo related to the values for 3.3 V LVCMOS Wide Range in Table 2-17
corrected (SAR 37227).
The notes regarding drive strength in the "Summary of I/O Timing Characteristics
section and tables were revised for clarification. They now state that the minimum
drive strength for the default software configuration when run in wide range is
±100 A. The drive strength displayed in software is supported in normal range
only. For a detailed I/V curve, refer to the IBIS models (SAR 34763).
Revision
Changes
Page
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| EP4CGX150CF23C8 | IC CYCLONE IV FPGA 150K 484FBGA |
| W25Q32DWZPIG | IC FLASH SPI 32MBIT 8WSON |
| EP2AGX45DF25C6N | IC ARRIA II GX FPGA 45K 572FBGA |
| PCF8582C-2P/03,112 | IC EEPROM 2KBIT 100KHZ 8DIP |
| EP4CGX110DF31C8 | IC CYCLONE IV FPGA 110K 896FBGA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| M1A3PE3000L-PQ208I | 功能描述:IC FPGA 1KB FLASH 3M 208-PQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3EL 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門(mén)數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類(lèi)型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP（75x75） |
| M1A3PE3000L-PQG144M | 制造商:ACTEL 制造商全稱(chēng):Actel Corporation 功能描述:Military ProASIC3/EL Low-Power Flash FPGAs |
| M1A3PE3000L-PQG208 | 功能描述:IC FPGA 1KB FLASH 3M 208-PQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3EL 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門(mén)數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類(lèi)型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23） |
| M1A3PE3000L-PQG208I | 功能描述:IC FPGA 1KB FLASH 3M 208-PQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3EL 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門(mén)數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類(lèi)型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP（75x75） |
| M1A3PE3000-PQ208 | 功能描述:IC FPGA 1KB FLASH 3M 208-PQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3E 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門(mén)數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類(lèi)型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23） |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。