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參數(shù)資料
| 型號(hào)： | M14C32DD |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | TERMINAL BLOCK, 8WAY; Connector type:Terminal Block, Barrier; Material, contact:Copper alloy; Plating, contact:Bright Tin; Positions, No. of:8; Pitch:0.375"; Mounting type:PC Board; Wire size, AWG:12AWG; Approval Bodies:UL, CSA; RoHS Compliant: Yes |
| 中文描述： | M14C32模具描述 |
| 文件頁(yè)數(shù)： | 3/13頁(yè) |
| 文件大?。?/td> | 277K |
| 代理商： | M14C32DD |
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MICROMODULES
3/13
Table 3. Manufacturing Flow and Manufacturing Facility Locations
Table 4. Material Specification
Operation
Location and Facility
Wafer Diffusion
Rousset, France. 6” wafer fab.
Agrate, Italy.6” wafer fab.: standard EEPROM only
Electrical Wafer Test
Rousset, France.
Agrate, Italy: standard EEPROM only
Assembly
Casablanca, Morocco.
Final Test
Rousset, France.
Casablanca, Morocco.
Material
Description
Tape
Basic material
MCTS T2 or IBIDEN rough, typical thickness 120
μ
m
Adhesive
Modified epoxy, typical thickness 18
μ
m
Laminated copper foil
Typical thickness 35
μ
m
Adhesive strength
> 0.8 N/mm at room temperature. Monitored by the tape manufacturer using
appropriate test methods
Tape Surface
The whole epoxy adhesive surface is controlled to be free of dirt, grease, cleaning
compounds and parting compounds
Surface roughness
Typically Rz: 3-12
μ
m at first accepted delivery
Contact surface
Nickel-gold, galvanised treatment
Nickel thickness
2
μ
m (min.)
Gold thickness
contact side, 0.1
μ
m (min.)
Total tape thickness
160
±
30
μ
m
Control, Palmer
“Special flat” diameter 3 mm, F = 1.5 N
Chip Interconnect
Dice bonding
Silver epoxy
Bonding wire
Gold 25
μ
m
Ring (D22 only)
Bronze
Protective coating
Material
UV epoxy, Black epoxy
Assembly
Casablanca, Morocco.
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