參數(shù)資料
型號(hào): M14C32DD
廠商: 意法半導(dǎo)體
英文描述: TERMINAL BLOCK, 8WAY; Connector type:Terminal Block, Barrier; Material, contact:Copper alloy; Plating, contact:Bright Tin; Positions, No. of:8; Pitch:0.375"; Mounting type:PC Board; Wire size, AWG:12AWG; Approval Bodies:UL, CSA; RoHS Compliant: Yes
中文描述: M14C32模具描述
文件頁(yè)數(shù): 1/13頁(yè)
文件大?。?/td> 277K
代理商: M14C32DD
1/13
December 1999
D10, D15, D20, D22, C20, C30
MICROMODULES
Memory Micromodules
General Information for D1, D2 and C Packaging
I
Micromodules were developed specifically for
embedding in Smartcards and Memory Cards
I
The Micromodule provides:
– Support for the chip
– Electrical contacts
– Suitable embedding interface for gluing the
module to the plastic package
I
Physical dimensions and contact positions
compliant to the ISO 7816 standard
I
Micromodules delivered as a continuous Super
35 mm tape. (This differs from the standard
35 mm tape in the spacing distance between
the indexing holes.)
DESCRIPTION
Memory Cards consist of two main parts: the
plastic card, and the embedded Micromodule
(which, in turn, carries the silicon chip).
The plastic card is made of PVC, ABS or similar
material, and can be over-printed with graphics,
text, and magnetic strips. The Micromodule is
embedded in a cavity in the plastic card.
The Micromodules are mounted on Super 35 mm
metallized epoxy tape, and are delivered on reels.
These contain all of the chips from a number of
wafers, includingthosechips that were found to be
non-functioning during testing. Traceability is
ensured by a label fixed on the reel.
D10
D20
1
1
1
1
1
1
1
1
potting side
contact side
D15
D22
C30
C20
Table 1. Memory Card and Memory Tag Integrated Circuits
Module
Please see the data briefing sheets of these products for example illustrations of these
micromodules
D10
ST1200, ST1305B, ST1331, ST1333, ST1335, ST1336, ST1353, ST1355
D15
ST14C02, ST1305B, ST1335, ST1336, ST1355
D20
ST14C02, M14C04, M14C16, M14C32
D22
M14C64, M14128, M14256
C30
M35101, M35102
C20
M35101, M35102
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