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參數(shù)資料
| 型號(hào)： | M14C32DD |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | TERMINAL BLOCK, 8WAY; Connector type:Terminal Block, Barrier; Material, contact:Copper alloy; Plating, contact:Bright Tin; Positions, No. of:8; Pitch:0.375"; Mounting type:PC Board; Wire size, AWG:12AWG; Approval Bodies:UL, CSA; RoHS Compliant: Yes |
| 中文描述： | M14C32模具描述 |
| 文件頁(yè)數(shù)： | 2/13頁(yè) |
| 文件大?。?/td> | 277K |
| 代理商： | M14C32DD |
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MICROMODULES
The assembly flows is as follows:
1. Dice sawing
2. Dice attach
3. Wire bonding
4. Potting
5. Milling (depending on product)
The range of products and types of Micromodule
are summarized in Table 1 and Table 2. For large
volumes, ST is able to offer customized module
tape.
DELIVERY
The Super 35mm metallized epoxy tape is
delivered on reels, as shown in Figure 1. These
contain all of the chips from a number of wafers,
including those chips that were found to be non-
functioning during testing. Traceability is ensured
by a label fixed on the reel.
The typical quantity is 10,000 modules per reel,
with priority given to lot integrity on the reel. The
maximum quantity is 15,000 per reel.
Parts which are faulty (mechanically or electrically
defective) are identified by punch holes. The
specification for the reject punch holesis shown in
Figure 4 for the D10 micromodule, in Figure 5 for
the D15 micromodule, in Figure 6 for the D20
micromodule, and in Figure 7 for the D22
micromodule.
Tape joins (tape splicing) are never more than 10
per 10 metre length, as shown in Figure 2 and
Figure 3.
At least 2.1 m of leader, and 2.1 m of trailer is
included oneach reel. Each is made of PVC Super
35 mm tape, without metalisation, and is opaque
to infrared and white light.
A “failure” marking of reject holes is included at the
beginning and end of the tape of a minimum of 5
consecutive module pitches (double positions).
Modules should be stored within the temperature
range -40
°
C to + 85
°
C, for no more than 1 year.
Each reel is packed in an antistatic bag, alongwith
a desiccant bag, and a humidity indicator card.
This card indicates the level of humidity as follows:
30 - Blue: protection assured
40 - Pink: renew the desiccant bag
50 - Pink: protection no longer ensured
Three self adhesive plastic identification labels are
attached: one to the reel, one to theantistatic bag,
Table 2. Memory Card Products
Type
Description (please see the individual product data
sheets for full specifications)
Process
Technology
Module Style
ST14C02C
Memory Card IC, 2 Kbit (256 x 8) Serial I
2
C Bus EEPROM
1.2
μ
m
CMOS
D15, D20
M14C04
Memory Card IC, 4 Kbit Serial I
2
C Bus EEPROM
0.6
μ
m
CMOS
D20
M14C16
Memory Card IC, 16 Kbit Serial I
2
C Bus EEPROM
0.6
μ
m
CMOS
D20
M14C32
Memory Card IC, 32 Kbit Serial I
2
C Bus EEPROM
0.6
μ
m
CMOS
D20
M14C64
Memory Card IC, 64 Kbit Serial I
2
C Bus EEPROM
0.6
μ
m
CMOS
D22
M14128
Memory Card IC, 128 Kbit Serial I
2
C Bus EEPROM
0.6
μ
m
CMOS
D22
M14256
Memory Card IC, 256 Kbit Serial I
2
C Bus EEPROM
0.6
μ
m
CMOS
D22
ST1200
Memory Card IC, 256 bit OTP EPROM with Lock-Out
3.5
μ
m
NMOS
D10
ST1305B
Memory Card IC, 192 bit High Endurance EEPROM
with Secure Logic Access Control
1.5
μ
m
CMOS
D10, D15
ST1331
Memory Card IC, 272 bit High Endurance EEPROM
with Advanced Security Mechanisms
1.2
μ
m
CMOS
D10
ST1333
1.2
μ
m
CMOS
D10
ST1335
1.2
μ
m
CMOS
D10, D15
ST1336
1.2
μ
m
CMOS
D10, D15
M35101
Contactless Memory Chip, 13.56 MHz, 2048 bit EEPROM
0.6
μ
m
CMOS
C20, C30
M35102
Contactless Memory Chip with 64-bit Unique ID,
13.56 MHz, 2048 bit EEPROM
0.6
μ
m
CMOS
C20, C30
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PDF描述 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| M14C64 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:Memory Micromodules General Information for D1, D2 and C Packaging |
| M14D1G1664A-2.5BG2D | 制造商:ESMT 功能描述: |
| M14D2561616A | 制造商:ESMT 制造商全稱:Elite Semiconductor Memory Technology Inc. 功能描述:4M x 16 Bit x 4 Banks DDR II SDRAM |
| M14D2561616A-2.5BG | 制造商:ESMT 制造商全稱:Elite Semiconductor Memory Technology Inc. 功能描述:4M x 16 Bit x 4 Banks DDR II SDRAM |
| M14D2561616A-3BG | 制造商:ESMT 制造商全稱:Elite Semiconductor Memory Technology Inc. 功能描述:4M x 16 Bit x 4 Banks DDR II SDRAM |
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