參數(shù)資料
型號: M14C32
廠商: 意法半導(dǎo)體
英文描述: Memory Micromodules General Information for D1, D2 and C Packaging
中文描述: 一般資料記憶體微型模塊包裝為D1,D2級和C
文件頁數(shù): 10/13頁
文件大?。?/td> 277K
代理商: M14C32
1
M
2
7
2.2min
2.54
3
4.75
8
2
9.5
1
1.422
R0.15
2
±
0
1
±
0
5.2
±
0.2
(P)2.2
3
±
0
(M)1.5
7 max
0.16
0.58 max
0.1
DIE SIDE
CROSS SECTION
CONTACT SIDE
3
Copyright SGS-THOMSON Microelectronics. Unauthorized reproduction and communication is stricly
GRAPHIC TITLE:
GRAPHICS REV.
SCALE
none
CONTROLED BY:
DRAWN BY:
ROYER.G
DATUM
06/1998
Z.I. de Rousset
B.P. 2 - 13106 ROUSSET CEDEX
Fax (33) 42.53.22.88
Tel. (33) 42.25.88.00
POA FOR MICROMODULE D15
STEFFEN.F
A
NOTE:
- (P) is reject identification hole 2.2
- (M) may be punched with (P): center positioning
±
0.2
- Sproket holes may be with or without metalisation
- Recommended punching contour for the customer: 8.32*11
- Minimal contact area according to ISO 7816-1
R1.4
GENERAL TOLERANCE IS
±
0.1 mm
ALL DIMENSIONS ARE IN MILLIMETERS
Measurements are subject to change without notice
PACKAGE CODE
FU
8.12
1
F
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