LX5512E
P
RELIMINARY
D
ATA
S
HEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
W
M
.
C
InGaP HBT 2.4-2.5GHz Power Amplifier
I N T E G R A T E D P R O D U C T S
Copyright
2002
Rev. 1.0, 2003-01-10
ABSOLUTE MAXIMUM RATINGS
DC Supply Voltage, RF off ...............................................................................5V
Collector Current ........................................................................................400mA
Total Power Dissipation....................................................................................2W
RF Input Power............................................................................................-5dBm
Operation Ambient Temperature.......................................................-40 to +85°C
Storage Temperature..........................................................................-60 to 150°C
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
PACKAGE PIN OUT
1
4
5
9
10
11
2
3
6
7
8
12
13
14
15 16
LQ
P
ACKAGE
(Bottom View)
FUNCTIONAL PIN DESCRIPTION
Name
Pin #
Description
RF IN
2,3
RF input for the power amplifier. This pin is AC-coupled to the transistor base of the first stage.
VB1
4
Bias current control voltage for the first stage.
VB2
6
Bias current control voltage for the second stage.
VB3
7
Bias current control voltage for the third stage. The VB3 pin can be connected with the first and second
stage control voltage (VB1,VB2) into a single reference voltage (referred to as Vref) through an
external resistor bridge.
Supply voltage for the bias reference and control circuits. The VCC feed line should be terminated with
a 10 nF bypass capacitor close to connector pin. This pin can be combined with VC1, VC2 and VC3
pins, resulting in a single supply voltage (referred to as Vc).
RF output for the power amplifier. This pin is DC-decoupled from the transistor collector of the third
stage.
Power supply for first stage amplifier. The VC1 feedline should be terminated with a 120pF bypass
capacitor, followed by a 10 Ohm resistor. This pin can be combined with VC2,VC3 and VCC pins,
resulting in a single supply voltage (referred to as Vc).
Power supply for second stage amplifier. The VC2 feedline should be terminated with a 47 pF bypass
capacitor, followed by a 5 Ohm resistor. This pin can be combined with VC1,VC3 and VCC pins,
resulting in a single supply voltage (referred to as Vc).
Power supply for the third stage amplifier. The VC3 feedline should be terminated with a 120 pF
bypass capacitor. This pin can be combined with VC1,VC2 and VCC pins, resulting in a single supply
voltage (referred to as Vc).
VCC
5
RF OUT
10, 11
VC1
16
VC2
14
VC3
12
REF
8
Power detector reference output pin should be terminated with a 100 kOhm loading resistor
DET
9
Power detector output pin should be terminated with a 100 kOhm loading resistor
GND
Center
Metal
The center metal base of the MLP package provides both DC and RF ground as well as heat sink for
the power amplifier.
P
A
C
K
A
G
E
D
A
T
A