參數(shù)資料
型號(hào)： LX5506BLQ
廠商： MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP
元件分類(lèi)： 衰減器
英文描述： InGaP HBT 4 6GHz Power Amplifier
中文描述： 4000 MHz - 6000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封裝： 3 X 3 MM, LEAD FREE, PLASTIC, MLPQ-16
文件頁(yè)數(shù)： 3/7頁(yè)
文件大?。?/td> 200K
代理商： LX5506BLQ
LX5506B
P
RODUCTION
D
ATA
S
HEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 3
W
M
.
C
InGaP HBT 4 – 6GHz Power Amplifier
Copyright
2003
Rev. 1.0b, 2005-03-02
TM
E L E C T R I C A L C H A R A C T E R I S T I C S
Unless otherwise specified, the following specifications apply over the following test conditions:
Vc = 3.3V, Vref=2.9V, Icq = 90mA,
and T
A
= 25°C
PARAMETER
CONDITION
SYMBOL
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
UNIT
Frequency Range
Output Power at 1dB Compression
Power Gain at Pout=+18dBm
EVM at Pout=+18dBm
Total Current at Pout=+18dBm
Quiescent Current
Bias Control Reference Current
Small-Signal Gain
Gain Flatness
Gain Variation Over Temperature
Input Return Loss
Output Return Loss
Reverse Isolation
Second Harmonic
Third Harmonic
Detector Response
Ramp-On Time
64QAM/54Mbps
For Icq=90mA
Over 200MHz
-40 to +85
o
C
Pout = +18dBm
Pout = +18dBm
Pout = +18dBm
10~90%
f
5.15
25
5.35
5.7
25
5.85
GHz
dBm
dB
%
mA
mA
mA
dB
dB
dB
dB
dB
dB
dBc
dBc
V
ns
Pout
Gp
Ic_total
Icq
Iref
S21
S21
S21
S11
S22
S12
DET
t
ON
26
25
2.5
170
90
4.2
24
+/-0.5
+/-1
-15
-8
-40
-40
-40
1.6
100
26
21
3
180
90
4.2
20
+/-0.5
+/-0.5
-10
-10
-40
-40
-40
2.2
100
Note: All measured data was obtained on a 10 mil GETEK evaluation board.
P A C K A G E D I M E N S I O N S
LQ
16-Pin MLPQ 3x3 (75 x 75 mil DAP)
e
D
E
b
E2
D2
A
A3
A1
L
K
M
ILLIMETERS
MIN
0.80
0
0.20 REF
0.18
3.00 BSC
3.00 BSC
0.50 BSC
1.55
1.55
0.2
0.35
I
NCHES
MIN
0.031
0
0.008 REF
0.007
0.118 BSC
0.118 BSC
0.020 BSC
0.061
0.061
0.008
0.012
Dim
A
A1
A3
b
D
E
e
D2
E2
K
L
MAX
1.00
0.05
MAX
0.039
0.002
0.30
0.012
1.80
1.80
-
0.50
0.071
0.071
-
0.020
Note:
1. Dimensions do not include mold flash or protrusions;
these shall not exceed 0.155mm(.006”) on any side.
Lead dimension shall not include solder coverage.
E
L
E
C
T
R
I
C
A
L
S
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