LTC6946
11
6946fa
PIN FUNCTIONS
VRF+ (Pin 13): 3.15V to 3.45V Positive Supply Pin for
RF Circuitry. This pin should be bypassed directly to the
ground plane using a 0.01μF ceramic capacitor as close
to the pin as possible.
BB (Pin 14): RF Reference Bypass. This output must be
bypassed with a 1.0μF ceramic capacitor to GND. Do not
couple this pin to any other signal.
TUNE (Pin 15): VCO Tuning Input. This frequency control
pin is normally connected to the external loop filter. See
the Applications Information section for more details.
TB (Pin 16): VCO Bypass. This output must be bypassed
with a 2.2μF ceramic capacitor to GND, and is normally
connected to CMA, CMB and CMC with a short trace. Do
not couple this pin to any other signal.
CMC, CMB, CMA (Pins 18, 19, 20): VCO Bias Inputs. These
inputs are normally connected to TB with a short trace
and bypassed with a 2.2μF ceramic capacitor to GND. Do
not couple these pins to any other signal. For best phase
noise performance, do not place a trace between these
pads underneath the package.
VVCO+ (Pin 22): 4.75V to 5.25V Positive Supply Pin for
VCO Circuitry. This pin should be bypassed directly to the
ground plane using both 0.01μF and 1μF ceramic capaci-
tors as close to the pin as possible.
GND (23): Negative Power Supply (Ground). This pin is
attached directly to the die attach paddle (DAP) and should
be tied directly to the ground plane.
VCP+ (Pin 24): 4.0V to 5.25V Positive Supply Pin for Charge
Pump Circuitry. This pin should be bypassed directly to
the ground plane using a 0.1μF ceramic capacitor as close
to the pin as possible.
CP (Pin 25): Charge Pump Output. This bi-directional
current output is normally connected to the external loop
filter. See the Applications Information section for more
details.
VREF+ (Pin 26): 3.15V to 3.45V Positive Supply Pin for
Reference Input Circuitry. This pin should be bypassed
directly to the ground plane using a 0.1μF ceramic capaci-
tor as close to the pin as possible.
REF+, REF– (Pins 27, 28):
Reference Input Signals. This
differential input is buffered with a low noise amplifier,
which feeds the reference divider and reference buffer.
They are self-biased and must be AC-coupled with 470pF
capacitors. If used single ended, bypass REF– to GND with
a 470pF capacitor.
GND (Exposed Pad Pin 29): Negative Power Supply
(Ground). The package exposed pad must be soldered
directly to the PCB land. The PCB land pattern should have
multiple thermal vias to the ground plane for both low
ground inductance and also low thermal resistance.