參數(shù)資料
型號(hào): LTC2230
廠商: Linear Technology Corporation
英文描述: 16-Bit Universal Bus Driver With 3-State Outputs 48-TVSOP -40 to 85
中文描述: 除電氣規(guī)格更改
文件頁(yè)數(shù): 27/28頁(yè)
文件大?。?/td> 695K
代理商: LTC2230
LTC2230/LTC2231
27
22301p
UP Package
64-Lead Plastic QFN (9mm
×
9mm)
(Reference LTC DWG # 05-08-1705)
PACKAGE DESCRIPTIO
U
9 .00
0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE
MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE
DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT,
SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 TOP MARK
(SEE NOTE 5)
0.40
±
0.10
64
63
1
2
BOTTOM VIEW—EXPOSED PAD
7.15
0.10
(4-SIDES)
0.75
±
0.05
R = 0.115
TYP
0.25
±
0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UP64) QFN 0903
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.70
±
0.05
7.15
0.05
(4 SIDES)
8.10
±
0.05 9.50
±
0.05
0.25
±
0.05
0.50 BSC
PACKAGE OUTLINE
PIN 1
CHAMFER
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
相關(guān)PDF資料
PDF描述
LTC2231 16-Bit Universal Bus Driver With 3-State Outputs 48-SSOP -40 to 85
LTC2230CUP Electrical Specifications Subject to Change
LTC2231IUP Electrical Specifications Subject to Change
LTC2232 16-Bit Universal Bus Driver With 3-State Outputs 48-TSSOP -40 to 85
LTC2249IUH 14-Bit, 80Msps Low Power 3V ADC
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