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參數(shù)資料
| 型號： | LPC2921FBD100 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | ARM9 microcontroller with CAN, LIN, and USB |
| 中文描述： | 32-BIT, FLASH, 125 MHz, RISC MICROCONTROLLER, PQFP100 |
| 封裝： | 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100 |
| 文件頁數(shù)： | 77/84頁 |
| 文件大?。?/td> | 551K |
| 代理商： | LPC2921FBD100 |
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LPC2921_23_25_3
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 14 April 2010
77 of 84
NXP Semiconductors
LPC2921/2923/2925
ARM9 microcontroller with CAN, LIN, and USB
12.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 33
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 40
and
41
Table 40.
Package thickness (mm)
Table 41.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 33
.
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LPC2921FBD100,551 | 功能描述:ARM微控制器 - MCU IC ARM9 MCU FLASH 128KB RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT |
| LPC2923 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:ARM9 microcontroller with CAN, LIN, and USB |
| LPC2923FBD100 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:ARM9 microcontroller with CAN, LIN, and USB device |
| LPC2923FBD100,551 | 功能描述:ARM微控制器 - MCU IC ARM9 MCU FLASH 256KB RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT |
| LPC2925 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:ARM9 microcontroller with CAN, LIN, and USB |
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