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2
Revision 1.0
L
3.0 Features
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Bluetooth version 1.1 qualified
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Implemented in CMOS technology on FR4 substrate
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Temperature Range: -40°C to +85°C
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FCC certified on LMX9820ADONGLE,
FCC ID ED9LMX9820ASM.
3.1 DIGITAL HARDWARE
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Baseband and Link Management processors
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CompactRISC Core
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Integrated Memory:
– Flash
– RAM
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UART Command/Data Port:
– Support for up to 921.6k baud rate
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Auxiliary Host Interface Ports:
– Link Status
– Transceiver Status (Tx or Rx)
– Operating Environment Control:
– Default Bluetooth mode
– In System Programming (ISP) mode
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Advanced Power Management (APM) features
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Advanced Audio Interface for external PCM codec
3.2 FIRMWARE
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Complete Bluetooth Stack including:
– Baseband and Link Manager
– L2CAP, RFCOMM, SDP
– Profiles:
– GAP
– SDAP
– SPP
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Additional Profile support on host for any SPP based
profile, like
– Dial Up Networking (DUN)
– Facsimile Profile (FAX)
– File Transfer Protocol (FTP)
– Object Push Profile (OPP)
– Headset (HSP)
– Handsfree Profile (HFP)
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On-chip application support including:
– Command Interface:
– Link setup and configuration (also Multipoint)
– Configuration of the module
– In-System Programming (ISP)
– Service database modifications
– Default connections
– UART Transparent mode
– Different Operation modes:
– Automatic mode
– Command mode
3.3 DIGITAL SMART RADIO
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Accepts external clock or crystal input:
– 12 MHz
– 20 ppm cumulative clock error required for Bluetooth
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Synthesizer:
– Integrated VCO and loop filter
– Provides all clocking for radio and baseband func-
tions
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Antenna Port (50 ohms nominal impedance):
– Embedded front-end filter for enhanced out of band
performance
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Integrated transmit/receive switch (full-duplex operation
via antenna port)
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Typical -81 dBm input sensitivity
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0 dBm typical output power
3.4 PHYSICAL DIMENSIONS
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Compact size: 10.1mm x 14.1mm x 2.0mm
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Complete system interface provided in Land Grid Array
on underside for surface-mount assembly
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Metal shield included
Figure 1. Physical Illustration