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| 型號： | LM75AD,112 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 20/24頁 |
| 文件大?。?/td> | 137K |
| 描述： | IC TEMP SENSOR DIGITAL 8-SOIC |
| 特色產(chǎn)品： | NXP - I2C Interface |
| 標(biāo)準(zhǔn)包裝： | 100 |
| 功能： | 溫度監(jiān)視系統(tǒng)（傳感器），監(jiān)視器 |
| 傳感器類型： | 內(nèi)部 |
| 感應(yīng)溫度： | -55°C ~ 125°C |
| 精確度： | ±3°C（最小值） |
| 拓?fù)洌?/td> | ADC（三角積分型），比較器，振蕩器，寄存器庫 |
| 輸出類型： | 2 線串行，I²C? |
| 輸出警報： | 無 |
| 輸出風(fēng)扇： | 是 |
| 電源電壓： | 2.8 V ~ 5.5 V |
| 工作溫度： | -55°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SO |
| 包裝： | 管件 |
| 產(chǎn)品目錄頁面： | 846 (CN2011-ZH PDF) |
| 配用： | 568-4002-ND - DEMO BOARD I2C |
| 其它名稱： | 568-4226-5 935269775112 LM75AD LM75AD-ND |
LM75A_4
?NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 10 July 2007
20 of 24
NXP Semiconductors
LM75A
Digital temperature sensor and thermal watchdog
14.4 Reow soldering
Key characteristics in reow soldering are:
" Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see
Figure
15) than a PbSn process, thus
reducing the process window
" Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
" Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
T
ab
le
19 and
20
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see
Figure
15.
Table 19. SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
e 350
< 2.5
235
220
e 2.5
220
220
Table 20. Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM75ADP | 制造商:NXP Semiconductors 功能描述:Digital Temp Sensor 2-Wire,LM75ADP |
| LM75ADP,118 | 功能描述:板上安裝溫度傳感器 TEMP SENSOR DIGITAL RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| LM75ADP,118 | 制造商:NXP Semiconductors 功能描述:IC, TEMP SENSOR, 0.125C, 3C, TSSOP-8 |
| LM75ADP,118-CUT TAPE | 制造商:NXP 功能描述:LM75A Series SMD 5.5 mA Digital Temperature Sensor w/ Thermal Watchdog TSSOP-8 |
| LM75ADP/DG,118 | 功能描述:板上安裝溫度傳感器 DIGITAL TEMP SENSOR AND THERMAL WATCHDOG RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
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