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Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
(Note 1)
PVIN, VDD to SGND
PGND to SGND, PVIN to VDD
EN, EAOUT, EANEG, SYNC/MODE
to SGND
FB, SW
0.2V to +6V
0.2V to +0.2V
0.2V to +6V
(GND 0.2V) to
(VDD +0.2V)
Storage Temperature Range
Lead Temperature
(Soldering, 10 sec.)
Junction Temperature (Note 2)
Ambient Temperature Range
Minimum ESD Rating
(Human Body Model, C = 100 pF, R = 1.5 k
)
Thermal Resistance (
θ
JA
) (Note 3)
45C to +150C
300C
+125C
-25C to 85C
±
2 kV
110C/W
Electrical Characteristics
Specifications with standard typeface are for T
= 25C, and those in
boldface type
apply over the full
Operating Junction
Temperature Range
of T
J
= 25C to +125C. Unless otherwise specified, PVIN = VDD = EN = SYNC/MODE = 3.6V.
Symbol
Parameter
Conditions
V
IN
Input Voltage Range
PVIN = VDD = V
IN
(Note 4)
V
FB
Feedback Voltage
V
HYST
PFM Comparator Hysteresis
Voltage
0V) (Note 5)
I
SHDN
Shutdown Supply Current
VIN = 3.6V, EN = 0V
I
Q1_PWM
DC Bias Current into VDD
SYNC/MODE = VIN
FB = 2V
I
Q2_PFM
SYNC/MODE = 0V
FB = 2V
R
DSON (P)
Pin-Pin Resistance for
P FET
R
DSON (N)
Pin-Pin Resistance for
N FET
R
DSON (TC)
FET Resistance
Temperature Coefficient
I
LIM
Switch Peak Current Limit
(Note 7)
V
IH
Logic High Input, EN,
SYNC/MODE
V
IL
Logic Low Input, EN,
SYNC/MODE
F
SYNC
SYNC/MODE Clock
Frequency Range
F
OSC
Internal Oscillator
Frequency
T
min
Minimum ON-Time of PFET
Switch in PWM Mode
Min
2.8
1.470
Typ
3.6
1.50
Max
5.5
1.530
Units
V
V
PFM Mode (SYNC/MODE =
29
mV
0.02
0.3
μA
600
725
μA
160
195
μA
(Note 6)
500
630
m
(Note 6)
420
550
m
0.5
%/C
620
850
1100
mA
0.95
1.3
V
0.4
0.80
V
(Note 8)
500
1000
kHz
PWM Mode
468
640
800
kHz
200
ns
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but device specifications may not be guaranteed. For guaranteed specifications and associated test conditions, see the Min and Max limits and Conditions
in the Electrical Characteristics table. Typical (typ) specifications are mean or average values at 25C and are not guaranteed.
Note 2:
Thermal shutdown will occur if the junction temperature exceeds 150C.
Note 3:
Thermal resistance specified with 4" x 3" JEDEC (2 layer 2 oz Cu.) board.
Note 4:
The LM2619MTC is designed for mobile phone applications where turn-on after system power-up is controlled by the system controller. Thus, it should be
kept in shutdown by holding the EN pin low until the input voltage exceeds 2.8V.
Note 5:
The hysteresis voltage is the minimum voltage swing on the FB pin that causes the internal feedback and control circuitry to turn the internal PFET switch
on and then off during PFM mode. When resistor dividers are used like in the operating circuit of
Figure 4
, the hysteresis at the output will be the value of the
hysteresis at the feedback pin times the resistor divider ratio. In this case, 24mV (typ) x ((46.4k + 33.2k)/33.2k).
Note 6:
R
DSON
is specified by having the two PVIN pins connected together,two PGND pins connected together and the two SW pins connected together.
Note 7:
Current limit is built-in, fixed, and not adjustable. If the current limit is reached while the voltage at the FB pin is pulled below 0.7V, the internal PFET switch
turns off for 2.5μs to allow the inductor current to diminish.
Note 8:
SYNC driven with an external clock switching between V
and GND. When an external clock is present at SYNC; the IC is forced to be in PWM mode at
the external clock frequency. The LM2619MTC synchronizes to the rising edge of the external clock.
L
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