參數(shù)資料
型號: LAN8187I
廠商: SMSC Corporation
英文描述: High-Performance MII and RMII 10/100 Ethernet PHY with HP Auto-MDIX
中文描述: 高性能信息產(chǎn)業(yè)部及RMII 10/100以太網(wǎng)PHY與HP Auto - MDIX功能
文件頁數(shù): 66/66頁
文件大?。?/td> 545K
代理商: LAN8187I
High-Performance MII and RMII 10/100 Ethernet PHY with HP Auto-MDIX
Datasheet
Revision 0.6 (02-24-06)
66
SMSC LAN8187/LAN8187I
DATASHEET
Chapter 7 Package Outline
Figure 7.1 64 Pin TQFP Package Outline, 10X10X1.4 Body, 12x12 mm Footprint
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm per side.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Table 7.1 64 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
A1
A2
D
D1
E
E1
H
L
L1
e
θ
W
R
R2
ccc
~
~
~
~
~
~
~
~
~
1.60
0.15
1.45
12.20
10.20
12.20
10.20
0.20
0.75
~
Overall Package Height
Standoff
Body Thickness
X Span
X body Size
Y Span
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
0.05
1.35
11.80
9.80
11.80
9.80
0.09
0.45
~
0.60
1.00
0.50 Basic
~
0.22
~
~
~
0
o
0.17
0.08
0.08
~
7
o
0.27
~
0.20
0.08
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