
12
Am29LV800B
The device features an 
Unlock Bypass
 mode to facil-
itate faster programming. Once the device enters the 
Unlock Bypass mode, only two write cycles are 
required to program a word or byte, instead of four. 
The “Word/Byte Program Command Sequence”
section has details on programming data to the 
device using both standard and Unlock Bypass 
command sequences.
An erase operation can erase one sector, multiple sec-
tors, or the entire device. Tables 2 and 3 indicate the 
address space that each sector occupies. A “sector 
address” consists of the address bits required to 
uniquely select a sector. The “Command Definitions”
section has details on erasing a sector or the entire 
chip, or suspending/resuming the erase operation.
After the system writes the autoselect command 
sequence, the device enters the autoselect mode. 
The system can then read autoselect codes from the 
internal register (which is separate from the memory 
array) on DQ7–DQ0. Standard read cycle timings 
apply in this mode. Refer to the “Autoselect Mode”
and “Autoselect Command Sequence” sections for 
more information.
I
CC2
 in the DC Characteristics table represents the 
active current specification for the write mode. The 
“AC Characteristics” section contains timing specifica-
tion tables and timing diagrams for write operations.
Program and Erase Operation Status
During an erase or program operation, the system 
may check the status of the operation by reading the 
status bits on DQ7–DQ0. Standard read cycle timings 
and I
CC
 read specifications apply. Refer to “Write 
Operation Status” for more information, and to “AC 
Characteristics” for timing diagrams.
Standby Mode
When the system is not reading or writing to the 
device, it can place the device in the standby mode. 
In this mode, current consumption is greatly reduced, 
and the outputs are placed in the high impedance 
state, independent of the OE# input. 
The device enters the CMOS standby mode when the 
CE# and RESET# pins are both held at V
CC 
±
 0.3 V. 
(Note that this is a more restricted voltage range than 
V
IH
.) If CE# and RESET# are held at V
IH
, but not 
within V
CC 
±
 0.3 V, the device will be in the standby 
mode, but the standby current will be greater. The 
device requires standard access time (t
CE
) for read 
access when the device is in either of these standby 
modes, before it is ready to read data.
If the device is deselected during erasure or program-
ming, the device draws active current until the 
operation is completed.
In the DC Characteristics table, I
CC3 
and I
CC4 
repre-
sents the standby current specification. 
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device 
energy consumption. The device automatically 
enables this mode when addresses remain stable for 
t
ACC
 + 30 ns. The automatic sleep mode is indepen-
dent of the CE#, WE#, and OE# control signals. Stan-
dard address access timings provide new data when 
addresses are changed. While in sleep mode, output 
data is latched and always available to the system. 
I
CC4
 in the DC Characteristics table represents the 
automatic sleep mode current specification.
RESET#: Hardware Reset Pin
The RESET# pin provides a hardware method of 
resetting the device to reading array data. When the 
RESET# pin is driven low for at least a period of t
RP
, 
the device
 immediately terminates
 any operation 
in progress, tristates all output pins, and ignores all 
read/write commands for the duration of the RESET# 
pulse. The device also resets the internal state 
machine to reading array data. The operation that 
was interrupted should be reinitiated once the device 
is ready to accept another command sequence, to 
ensure data integrity.
Current is reduced for the duration of the RESET# 
pulse. When RESET# is held at V
SS
±0.3 V, the device 
draws CMOS standby current (I
CC4
). If RESET# is 
held at V
IL
 but not within V
SS
±0.3 V, the standby 
current will be greater.
The RESET# pin may be tied to the system reset cir-
cuitry. A system reset would thus also reset the Flash 
memory, enabling the system to read the boot-up 
firmware from the Flash memory.
If RESET# is asserted during a program or erase 
operation, the RY/BY# pin remains a “0” (busy) until 
the internal reset operation is complete, which 
requires a time of t
READY
 (during Embedded Algo-
rithms). The system can thus monitor RY/BY# to 
determine whether the reset operation is complete. If 
RESET# is asserted when a program or erase opera-
tion is not executing (RY/BY# pin is “1”), the reset 
operation is completed within a time of t
READY 
(not 
during Embedded Algorithms). The system can read 
data t
RH
 after the RESET# pin returns to V
IH
.
Refer to the AC Characteristics tables for RESET# 
parameters and to Figure 14 for the timing diagram.
Output Disable Mode