參數(shù)資料
型號(hào): L6740L
廠商: STMICROELECTRONICS
元件分類(lèi): 模擬信號(hào)調(diào)理
英文描述: SPECIALTY ANALOG CIRCUIT, PQFP48
封裝: 7 X 7 MM, 1 MM HEIGHT, HTQFP-48
文件頁(yè)數(shù): 4/44頁(yè)
文件大?。?/td> 755K
代理商: L6740L
Pins description and connection diagrams
L6740L
2.2
Thermal data
Table 3.
Thermal data
42
NB
section
NB_ENDRV
External driver enable.
Open drain output used to control NB section external driver status:
pulled-low to manage HiZ conditions or pulled-high to enable the driver.
Pull up to 3.3 V (typ) or lower.
When in PVI mode, NB section is always kept in HiZ.
43
CORE
section
ENDRV
External driver enable.
Open drain output used to control CORE section external driver status:
pulled-low to manage HiZ conditions or pulled-high to enable the driver.
Pull up to 3.3 V (typ) or lower.
44
NB
section
NB_PWM
PWM output.
Connect to external driver PWM input. The device is able to manage
HiZ status by setting the pin floating. When in PVI mode, NB section is
kept in HiZ. See Section 5.4.4 for details about HiZ management.
45 to
48
COR
E
section
PWM1 to
PWM4
PWM outputs.
Connect to external drivers PWM inputs. The device is able to manage
HiZ status by setting the pins floating.
By shorting to SGND PWM4 or PWM3 and PWM4, it is possible to
program the CORE section to work at 3 or 2 phase respectively.
See Section 5.4.4 for details about HiZ management.
Thermal pad
Thermal pad connects the silicon substrate and makes good thermal
contact with the PCB. Connect to the PGND plane.
Table 2.
Pin description (continued)
Pin#
Name
Function
Symbol
Parameter
Value
Unit
RthJA
Thermal resistance junction to ambient
(device soldered on 2s2p PC board)
40
°C/W
RthJC
Thermal resistance junction to case
1
°C/W
TMAX
Maximum junction temperature
150
°C
TSTG
Storage temperature range
-40 to 150
°C
TJ
Junction temperature range
0 to 125
°C
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