參數(shù)資料
型號(hào)： KMPC8241LZQ166D
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 5/58頁(yè)
文件大?。?/td> 0K
描述： IC MPU 32BIT 166MHZ 357-PBGA
標(biāo)準(zhǔn)包裝： 2
系列： MPC82xx
處理器類型： 32-位 MPC82xx PowerQUICC II
速度： 166MHz
電壓： 1.8V
安裝類型： 表面貼裝
封裝/外殼： 357-BBGA
供應(yīng)商設(shè)備封裝： 357-PBGA（25x25）
包裝： 托盤(pán)
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
13
Electrical and Thermal Characteristics
4.4
Thermal Characteristics
Table 6 provides the package thermal characteristics for the MPC8241. For details, see Section 7.7,
4.5
AC Electrical Characteristics
After fabrication, functional parts are sorted by maximum processor core frequency as shown in Table 7
and tested for conformance to the AC specifications for that frequency. The processor core frequency is
determined by the bus (PCI_SYNC_IN) clock frequency and the settings of the PLL_CFG[0:4] signals.
Parts are sold by maximum processor core frequency. See Section 8, “Ordering Information.”
Table 6. Thermal Characterization Data
Rating
Thermal Test Board
Description
Symbol
Value 7
(166- and
200-MHz
Parts)
Value 7
(266-MHz
Part)
Unit
Notes
Junction-to-ambient natural
convection
Single-layer board (1s)
RθJA
38
28
°C/W
1, 2
Junction-to-ambient natural
convection
Four-layer board (2s2p)
RθJMA
25
20
°C/W
1, 3
Junction-to-ambient (@200 ft/min) Single-layer board (1s)
RθJMA
31
22
°C/W
1, 3
Junction-to-ambient (@200 ft/min) Four-layer board (2s2p)
RθJMA
22
17
°C/W
1, 3
Junction-to-board (bottom)
Four-layer board (2s2p)
RθJB
17
11
°C/W
4
Junction-to-case (top)
Single-layer board (1s)
RθJC
87
°C/W
5
Junction-to-package top
Natural convection
Ψ
JT
22
°C/W
6
Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and EIA/JESD51-2 with the board horizontal.
3. Per EIA/JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per EIA/JESD51-2.
7. Note that the 166- and 200-MHz parts are in a two-layer package and the 266-MHz part is in a four-layer package, which
causes the two package types to have different thermal characterization data.
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