參數(shù)資料
型號(hào)： KMPC8241LZQ166D
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 47/58頁(yè)
文件大?。?/td> 0K
描述： IC MPU 32BIT 166MHZ 357-PBGA
標(biāo)準(zhǔn)包裝： 2
系列： MPC82xx
處理器類型： 32-位 MPC82xx PowerQUICC II
速度： 166MHz
電壓： 1.8V
安裝類型： 表面貼裝
封裝/外殼： 357-BBGA
供應(yīng)商設(shè)備封裝： 357-PBGA（25x25）
包裝： 托盤(pán)
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
51
System Design Information
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
7.7.3
Heat Sink Usage
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature for the package (°C)
RθJA = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, two values are in common usage: the value determined
on a single-layer board and the value obtained on a board with two planes. For packages such as the PBGA,
these values can be different by a factor of two. Which value is closer to the application depends on the
power dissipated by other components on the board. The value obtained on a single-layer board is
appropriate for the tightly packed printed-circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (°C/W)
RθJC = junction-to-case thermal resistance (°C/W)
RθCA = case-to-ambient thermal resistance (°C/W)
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the airflow around the device, the interface material, the mounting arrangement on the printed-circuit
board, or the thermal dissipation on the printed-circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the
thermal characterization parameter (
ψJT) measures the temperature at the top center of the package case
using the following equation:
TJ = TT + (ψJT × PD)
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