參數(shù)資料
型號: KM416V4104B
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 4M x 16bit CMOS Dynamic RAM with Extended Data Out
中文描述: 4米× 16位的CMOS動態(tài)隨機存儲器的擴展數(shù)據(jù)輸出
文件頁數(shù): 4/36頁
文件大?。?/td> 806K
代理商: KM416V4104B
KM416V4004B,
KM416V4104B
CMOS DRAM
*Note :
I
CC1
, I
CC3
, I
CC4
and I
CC6
are dependent on output loading and cycle rates. Specified values are obtained with the output open.
I
CC
is specified as an average current. In I
CC1
, I
CC3
and I
CC6,
address can be changed maximum once while RAS=V
IL
. In I
CC4
,
address can be changed maximum once within one EDO mode cycle time,
t
HPC
.
DC AND OPERATING CHARACTERISTICS
(Continued)
I
CC1
* : Operating Current (RAS and UCAS, LCAS, Address cycling @
t
RC
=min.)
I
CC2
: Standby Current (RAS=UCAS=LCAS=W=V
IH
)
I
CC3
* : RAS-only Refresh Current (UCAS=LCAS=V
IH
, RAS, Address cycling @
t
RC
=min.)
I
CC4
* : Extended Data Out Mode Current (RAS=V
IL
, UCAS or LCAS, Address cycling @
t
HPC
=min.)
I
CC5
: Standby Current (RAS=UCAS=LCAS=W=V
CC
-0.2V)
I
CC6
* : CAS-Before-RAS Refresh Current (RAS and UCAS or LCAS cycling @
t
RC
=min)
I
CC7
: Battery back-up current, Average power supply current, Battery back-up mode
Input high voltage(V
IH
)=V
CC
-0.2V, Input low voltage(V
IL
)=0.2V, UCAS, LCAS=CAS-before-RAS cycling or 0.2V
W, OE=V
IH
, Address=Don
t care, DQ=Open, T
RC
=31.25us
I
CCS
: Self Refresh Current
RAS=UCAS=LCAS=0.2V, W=OE=A0 ~ A12(A11)=V
CC
-0.2V or 0.2V, DQ0 ~ DQ15=V
CC
-0.2V, 0.2V or Open
Symbol
Power
Speed
Max
Units
KM416V4004B
KM416V4104B
I
CC1
Don
t care
-45
-5
-6
100
90
80
130
120
110
mA
mA
mA
I
CC2
Normal
L
Don
t care
2
2
2
2
mA
mA
I
CC3
Don
t care
-45
-5
-6
100
90
80
130
120
110
mA
mA
mA
I
CC4
Don
t care
-45
-5
-6
110
100
90
120
110
100
mA
mA
mA
I
CC5
Normal
L
Don
t care
500
300
500
300
uA
uA
I
CC6
Don
t care
-45
-5
-6
100
90
80
130
120
110
mA
mA
mA
I
CC7
L
Don
t care
400
400
uA
I
CCS
L
Don
t care
400
400
uA
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