MAXIMUM RATINGS THERMAL RATINGS Package Oper" />
參數(shù)資料
型號： KIT908E624DWBEVB
廠商： Freescale Semiconductor
文件頁數(shù)： 36/39頁
文件大小： 0K
描述： KIT EVAL 908E624 TRPL W/MCU/LIN
標(biāo)準(zhǔn)包裝： 1
系列： HC08, SMARTMOS™
類型： MCU
適用于相關(guān)產(chǎn)品： MM908E624
所含物品： 板，線纜，CD
相關(guān)產(chǎn)品： MM908E624ACEWR2DKR-ND - IC SWITCH TRPL HI MCU/LIN 54SOIC
MM908E624ACEWR2CT-ND - IC SWITCH TRPL HI MCU/LIN 54SOIC
MM908E624ACDWB-ND - IC TRPL SWITCH MCU/LIN 54-SOIC
MM908E624ACDWBR2-ND - IC TRPL SWITCH MCU/LIN 54-SOIC
MM908E624AYEWR2-ND - IC TRPL SWITCH MCU/LIN 54-SOIC
MM908E624AYEW-ND - IC TRPL SWITCH MCU/LIN 54-SOIC
MM908E624ACEWR2TR-ND - IC SWITCH TRPL HI MCU/LIN 54SOIC
MM908E624ACEW-ND - IC SWITCH TRIPLE MCU/LIN 54-SOIC
Analog Integrated Circuit Device Data
6
Freescale Semiconductor
908E624
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
THERMAL RATINGS
Package Operating Ambient Temperature (4)
MM908E624ACPEW
MM908E624AYPEW
TA
-40 to 85
-40 to 125
°C
Operating Junction Temperature (2)(4)
MM908E624ACPEW
MM908E624AYPEW
TJ
-40 to 125
°C
Storage Temperature
TSTG
-40 to 150
°C
Peak Package Reflow Temperature During Reflow(3)(5)
TPPRT
°C
Notes
2.
The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation of the analog die. The analog die junction temperature must not exceed 150°C under these conditions.
3.
Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
4.
Independent of TA, device parametrics are only guaranteed for -40 < TJ < 125 °C. Please see note 2. TJ is a factor of power dissipation,
package thermal resistance, and available heat sinking.
5.
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any pin may cause permanent damage to
the device.
Rating
Symbol
Value
Unit
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