- 鎮ㄧ従(xi脿n)鍦ㄧ殑浣嶇疆锛�璨疯常IC缍�(w菐ng) > PDF鐩寗9991 > ISL26323FBZ (Intersil)IC ADC 12BIT SPI/SRL 250K 8SOIC PDF璩囨枡涓嬭級
鍙冩暩(sh霉)璩囨枡
| 鍨嬭櫉锛� | ISL26323FBZ |
| 寤犲晢锛� | Intersil |
| 鏂囦欢闋佹暩(sh霉)锛� | 15/23闋� |
| 鏂囦欢澶�?銆�?/td> | 0K |
| 鎻忚堪锛� | IC ADC 12BIT SPI/SRL 250K 8SOIC |
| 妯欐簴鍖呰锛� | 980 |
| 浣嶆暩(sh霉)锛� | 12 |
| 閲囨ǎ鐜囷紙姣忕锛夛細 | 250k |
| 鏁�(sh霉)鎿�(j霉)鎺ュ彛锛� | 涓茶锛孲PI? |
| 杞夋彌鍣ㄦ暩(sh霉)鐩細 | 1 |
| 鍔熺巼鑰楁暎锛堟渶澶э級锛� | 80mW |
| 闆诲闆绘簮锛� | 鍠浕婧� |
| 宸ヤ綔婧害锛� | -40°C ~ 125°C |
| 瀹夎椤炲瀷锛� | 琛ㄩ潰璨艰 |
| 灏佽/澶栨锛� | 8-SOIC锛�0.154"锛�3.90mm 瀵級 |
| 渚涙噳鍟嗚ō鍌欏皝瑁濓細 | 8-SOIC |
| 鍖呰锛� | 绠′欢 |
| 杓稿叆鏁�(sh霉)鐩拰椤炲瀷锛� | 2 鍊嬪柈绔�锛屽柈妤� |
绗�1闋�绗�2闋�绗�3闋�绗�4闋�绗�5闋�绗�6闋�绗�7闋�绗�8闋�绗�9闋�绗�10闋�绗�11闋�绗�12闋�绗�13闋�绗�14闋�鐣跺墠绗�15闋�绗�16闋�绗�17闋�绗�18闋�绗�19闋�绗�20闋�绗�21闋�绗�22闋�绗�23闋�
ISL26320, ISL26321, ISL26322, ISL26323, ISL26324, ISL26325, ISL26329
22
FN8273.1
September 5, 2013
Package Outline Drawing
M16.173
16 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 2, 5/10
0.09-0.20
SEE DETAIL "X"
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
SIDE VIEW
END VIEW
Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
Dimensions are measured at datum plane H.
Dimensioning and tolerancing per ASME Y14.5M-1994.
Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
is 0.07mm.
Dimension in ( ) are for reference only.
Conforms to JEDEC MO-153.
6.
3.
5.
4.
2.
1.
NOTES:
7.
(0.65 TYP)
(5.65)
(0.35 TYP)
0.90 +0.15/-0.10
0.60 卤0.15
0.15 MAX
0.05 MIN
PLANE
GAUGE
0掳-8掳
0.25
1.00 REF
(1.45)
16
2
1
3
8
B
1
3
9
A
PIN #1
I.D. MARK
5.00 卤0.10
6.40
4.40 卤0.10
0.65
1.20 MAX
SEATING
PLANE
0.25 +0.05/-0.06 5
C
H
0.20 C B A
0.10 C
-
0.05
0.10
C B A
M
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鐩搁棞浠ｇ悊鍟�/鎶€琛撳弮鏁�(sh霉) |
鍙冩暩(sh霉)鎻忚堪 |
|---|---|
| ISL26323FBZ-T | 鍔熻兘鎻忚堪:IC ADC 12BIT SPI/SRL 250K 8SOIC RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 鏁�(sh霉)鎿�(j霉)閲囬泦 - 妯℃暩(sh霉)杞夋彌鍣� 绯诲垪:- 鐢�(ch菐n)鍝佸煿瑷撴ā濉�:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 妯欐簴鍖呰:250 绯诲垪:- 浣嶆暩(sh霉):12 閲囨ǎ鐜囷紙姣忕锛�:1.8M 鏁�(sh霉)鎿�(j霉)鎺ュ彛:骞惰伅(li谩n) 杞夋彌鍣ㄦ暩(sh霉)鐩�:1 鍔熺巼鑰楁暎锛堟渶澶э級:1.82W 闆诲闆绘簮:妯℃摤鍜屾暩(sh霉)瀛� 宸ヤ綔婧害:-40°C ~ 85°C 瀹夎椤炲瀷:琛ㄩ潰璨艰 灏佽/澶栨:48-LQFP 渚涙噳鍟嗚ō鍌欏皝瑁�:48-LQFP锛�7x7锛� 鍖呰:绠′欢 杓稿叆鏁�(sh霉)鐩拰椤炲瀷:2 鍊嬪柈绔�锛屽柈妤� |
| ISL26323FBZ-T7A | 鍔熻兘鎻忚堪:IC ADC 12BIT SPI/SRL 250K 8SOIC RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 鏁�(sh霉)鎿�(j霉)閲囬泦 - 妯℃暩(sh霉)杞夋彌鍣� 绯诲垪:- 鐢�(ch菐n)鍝佸煿瑷撴ā濉�:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 妯欐簴鍖呰:250 绯诲垪:- 浣嶆暩(sh霉):12 閲囨ǎ鐜囷紙姣忕锛�:1.8M 鏁�(sh霉)鎿�(j霉)鎺ュ彛:骞惰伅(li谩n) 杞夋彌鍣ㄦ暩(sh霉)鐩�:1 鍔熺巼鑰楁暎锛堟渶澶э級:1.82W 闆诲闆绘簮:妯℃摤鍜屾暩(sh霉)瀛� 宸ヤ綔婧害:-40°C ~ 85°C 瀹夎椤炲瀷:琛ㄩ潰璨艰 灏佽/澶栨:48-LQFP 渚涙噳鍟嗚ō鍌欏皝瑁�:48-LQFP锛�7x7锛� 鍖呰:绠′欢 杓稿叆鏁�(sh霉)鐩拰椤炲瀷:2 鍊嬪柈绔紝鍠サ |
| ISL26324 | 鍒堕€犲晢:INTERSIL 鍒堕€犲晢鍏ㄧū:Intersil Corporation 鍔熻兘鎻忚堪:12-bit, 250kSPS Low-power ADCs with Single-ended and Differential Inputs and Multiple Input Channels |
| ISL26324FVZ | 鍔熻兘鎻忚堪:IC ADC 12BIT SPI/SRL 16-TSSOP RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 鏁�(sh霉)鎿�(j霉)閲囬泦 - 妯℃暩(sh霉)杞夋彌鍣� 绯诲垪:- 鐢�(ch菐n)鍝佸煿瑷撴ā濉�:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 妯欐簴鍖呰:250 绯诲垪:- 浣嶆暩(sh霉):12 閲囨ǎ鐜囷紙姣忕锛�:1.8M 鏁�(sh霉)鎿�(j霉)鎺ュ彛:骞惰伅(li谩n) 杞夋彌鍣ㄦ暩(sh霉)鐩�:1 鍔熺巼鑰楁暎锛堟渶澶э級:1.82W 闆诲闆绘簮:妯℃摤鍜屾暩(sh霉)瀛� 宸ヤ綔婧害:-40°C ~ 85°C 瀹夎椤炲瀷:琛ㄩ潰璨艰 灏佽/澶栨:48-LQFP 渚涙噳鍟嗚ō鍌欏皝瑁�:48-LQFP锛�7x7锛� 鍖呰:绠′欢 杓稿叆鏁�(sh霉)鐩拰椤炲瀷:2 鍊嬪柈绔�锛屽柈妤� |
| ISL26324FVZ-T | 鍔熻兘鎻忚堪:IC ADC 12BIT SPI/SRL 16-TSSOP RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 鏁�(sh霉)鎿�(j霉)閲囬泦 - 妯℃暩(sh霉)杞夋彌鍣� 绯诲垪:- 鐢�(ch菐n)鍝佸煿瑷撴ā濉�:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 妯欐簴鍖呰:250 绯诲垪:- 浣嶆暩(sh霉):12 閲囨ǎ鐜囷紙姣忕锛�:1.8M 鏁�(sh霉)鎿�(j霉)鎺ュ彛:骞惰伅(li谩n) 杞夋彌鍣ㄦ暩(sh霉)鐩�:1 鍔熺巼鑰楁暎锛堟渶澶э級:1.82W 闆诲闆绘簮:妯℃摤鍜屾暩(sh霉)瀛� 宸ヤ綔婧害:-40°C ~ 85°C 瀹夎椤炲瀷:琛ㄩ潰璨艰 灏佽/澶栨:48-LQFP 渚涙噳鍟嗚ō鍌欏皝瑁�:48-LQFP锛�7x7锛� 鍖呰:绠′欢 杓稿叆鏁�(sh霉)鐩拰椤炲瀷:2 鍊嬪柈绔�锛屽柈妤� |
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