6
FN8233.9
November 30, 2010
tAA
SCL Falling Edge to SDA Output
Data Valid
SCL falling edge crossing 30% of VDD,
until SDA exits the 30% to 70% of VDD
window.
900
ns
tBUF
Time the bus must be free before
the start of a new transmission
SDA crossing 70% of VDD during a
STOP condition, to SDA crossing 70%
of VDD during the following START
condition.
1300
ns
tLOW
Clock LOW Time
Measured at the 30% of VDD crossing.
1300
ns
tHIGH
Clock HIGH Time
Measured at the 70% of VDD crossing.
600
ns
tSU:STA
START Condition Setup Time
SCL rising edge to SDA falling edge.
Both crossing 70% of VDD.
600
ns
tHD:STA
START Condition Hold Time
From SDA falling edge crossing 30%
of VDD to SCL falling edge crossing
70% of VDD.
600
ns
tSU:DAT
Input Data Setup Time
From SDA exiting the 30% to 70% of
VDD window, to SCL rising edge
crossing 30% of VDD
100
ns
tHD:DAT
Input Data Hold Time
From SCL falling edge crossing 70%
of VDD to SDA entering the 30% to
70% of VDD window.
0
ns
tSU:STO
STOP Condition Setup Time
From SCL rising edge crossing 70% of
VDD, to SDA rising edge crossing 30%
of VDD.
600
ns
tHD:STO
STOP Condition Hold Time for
Read, or Volatile Only Write
From SDA rising edge to SCL falling
edge. Both crossing 70% of VDD.
600
ns
tDH
Output Data Hold Time
From SCL falling edge crossing 30%
of VDD, until SDA enters the 30% to
70% of VDD window.
0
ns
Cb
Capacitive Loading of SDA or SCL Total on-chip and off-chip
10
400
pF
Cpin
SDA, and SCL Pin Capacitance
10
pF
tWC
Non-volatile Write Cycle Time
12
20
ms
tR
SDA and SCL Rise Time
From 30% to 70% of VDD
20 + 0.1 x Cb
250
ns
tF
SDA and SCL Fall Time
From 70% to 30% of VDD
20 + 0.1 x Cb
250
ns
Cb
Capacitive Loading of SDA or SCL Total on-chip and off-chip
10
400
pF
RPU
SDA and SCL Bus Pull-up Resistor
Off-chip
Maximum is determined by tR and tF.
For Cb = 400pF, max is about
2k
Ω~2.5kΩ.
For Cb = 40pF, max is about
15k
Ω~20kΩ
1
k
Ω
NOTES:
7. IRQ/FOUT Inactive (no frequency output and no alarms).
8. VIL = VDD x 0.1, VIH = VDD x 0.9, fSCL = 400kHz.
9. VRESET = 2.63V (VDD must be greater than VRESET), VBAT = 0V.
10. Bit BSW = 0 (Standard Mode), ATR = 00h, VBAT ≥ 1.8V.
11. Specified at +25°C.
12. In order to ensure proper timekeeping, the VDD SR- specification must be followed.
13. Parameter is not 100% tested.
14. tWC is the minimum cycle time to be allowed for any non-volatile Write by the user, it is the time from valid STOP condition at the end of Write
sequence of a serial interface Write operation, to the end of the self-timed internal non-volatile write cycle.
15. These are I2C specific parameters and are not directly tested, however they are used during device testing to validate device specification.
16. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
Serial Interface (I2C) Specifications Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued)
SYMBOL
PARAMETER
CONDITIONS
MIN
(Note 16)
TYP
MAX
(Note 16)
UNITS
NOTES
ISL12028, ISL12028A