參數(shù)資料
型號: IRLU4343PBF
元件分類: JFETs
英文描述: 26 A, 55 V, 0.05 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-251AA
封裝: LEAD FREE, PLASTIC, IPAK-3
文件頁數(shù): 1/11頁
文件大小: 302K
代理商: IRLU4343PBF
www.irf.com
1
12/8/04
Notes
through are on page 10
PD - 95394A
DIGITAL AUDIO MOSFET
IRLR4343PbF
IRLU4343PbF
IRLU4343-701PbF
I-Pak Leadform 701
IRLU4343-701
Refer to page 10 for package outline
D-Pak
IRLR4343
I-Pak
IRLU4343
Features
l Advanced Process Technology
l Key Parameters Optimized for Class-D Audio
Amplifier Applications
l Low RDSON for Improved Efficiency
l Low Qg and Qsw for Better THD and Improved
Efficiency
l Low Qrr for Better THD and Lower EMI
l 175°C Operating Junction Temperature for
Ruggedness
l Repetitive Avalanche Capability for Robustness and
Reliability
l Multiple Package Options
l Lead-Free
Description
This Digital Audio HEXFET
is specifically designed for Class-D audio amplifier applications. This MosFET utilizes the latest
processing techniques to achieve low on-resistance per silicon area. Furthermore, Gate charge, body-diode reverse recovery
and internal Gate resistance are optimized to improve key Class-D audio amplifier performance factors such as efficiency, THD
and EMI. Additional features of this MosFET are 175°C operating junction temperature and repetitive avalanche capability.
These features combine to make this MosFET a highly efficient, robust and reliable device for Class-D audio amplifier
applications.
S
D
G
VDS
55
V
RDS(ON) typ. @ VGS = 10V
42
m
:
RDS(ON) typ. @ VGS = 4.5V
57
m
:
Qg typ.
28
nC
TJ max
175
°C
Key Parameters
Absolute Maximum Ratings
Parameter
Units
VDS
Drain-to-Source Voltage
V
VGS
Gate-to-Source Voltage
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
A
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V
IDM
Pulsed Drain Current
c
PD @TC = 25°C
Power Dissipation
W
PD @TC = 100°C
Power Dissipation
Linear Derating Factor
W/°C
TJ
Operating Junction and
°C
TSTG
Storage Temperature Range
Clamping Pressure
h
N
Thermal Resistance
Parameter
Typ.
Max.
Units
RθJC
Junction-to-Case
g
–––
1.9
RθJA
Junction-to-Ambient (PCB Mounted)
gj
–––
50
°C/W
RθJA
Junction-to-Ambient (free air)
g
–––
110
-40 to + 175
–––
79
39
0.53
Max.
19
80
±20
55
26
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