參數(shù)資料
型號: IRF7726
廠商: International Rectifier
英文描述: Power MOSFET(Vdss=-30V)
中文描述: 功率MOSFET(30V的減振鋼板基本\u003d-)
文件頁數(shù): 1/9頁
文件大?。?/td> 95K
代理商: IRF7726
HEXFET
Power MOSFET
12/21/00
IRF7726
Absolute Maximum Ratings
www.irf.com
1
Thermal Resistance
Parameter
Max.
-30
-7.0
-5.7
-28
1.79
1.14
Units
V
V
DS
I
D
@ T
A
= 25°C
I
D
@ T
A
= 70°C
I
DM
P
D
@T
A
= 25°C
P
D
@T
A
= 70°C
Linear Derating Factor 0.01 W/°C
V
GS
Gate-to-Source Voltage
±20 V
T
J
, T
STG
Junction and Storage Temperature Range
Drain-Source Voltage
Continuous Drain Current, V
GS
@ -10V
Continuous Drain Current, V
GS
@ -10V
Pulsed Drain Current
Maximum Power Dissipation
Maximum Power Dissipation
A
W
W
-55 to +150
°C
PD -94064
V
DSS
-30V
R
DS(on)
max
0.026@V
GS
= -10V
0.040@V
GS
= -4.5V
I
D
-
7.0A
-
6.0A
Parameter
Max.
70
Units
°
C/W
R
θ
JA
Maximum Junction-to-Ambient
MICRO-8
Description
HEXFET
Power MOSFETs from International Recti-
fier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the ruggedized device design,
that International Rectifier is well known for, provides
the designer with an extremely efficient and reliable
device for battery and load management.
Ultra Low On-Resistance
P-Channel MOSFET
Very Small SOIC Package
Low Profile (< 1.2mm)
Available in Tape & Reel
The new Micro8 package, with half the footprint area
of the standard SO-8, provides the smallest footprint
available in an SOIC outline. This makes the Micro8
an ideal device for applications where printed circuit
board space is at a premium. The low profile (<1.2mm)
of the Micro8 will allow it to fit easily into extremely thin
application environments such as portable electronics
and PCMCIA cards.
Top View
8
1
2
3
4
5
6
7
D
D
D
G
S
A
D
S
S
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