IDT72V3611 3.3V, CMOS SyncFIFOTM 64 x 36 COMMERCIALTEMPERATURERANGE TIMING REQUIREMENTS OVER RECOMMEN" />
參數(shù)資料
型號: IDT72V3611L15PF
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 17/19頁
文件大小: 0K
描述: IC FIFO SYNC 64X36 15NS 120-TQFP
標(biāo)準(zhǔn)包裝: 45
系列: 72V
功能: 同步
存儲容量: 2.3K(64 x 36)
數(shù)據(jù)速率: 67MHz
訪問時(shí)間: 15ns
電源電壓: 3 V ~ 3.6 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 120-LQFP
供應(yīng)商設(shè)備封裝: 120-TQFP(14x14)
包裝: 托盤
其它名稱: 72V3611L15PF
7
IDT72V3611 3.3V, CMOS SyncFIFOTM
64 x 36
COMMERCIALTEMPERATURERANGE
TIMING REQUIREMENTS OVER RECOMMENDED RANGES OF SUPPLY
VOLTAGE AND OPERATING FREE-AIR TEMPERATURES
IDT72V3611L15
Symbol
Parameter
Min.
Max.
Unit
fS
Clock Frequency, CLKA or CLKB
66.7
Mhz
tCLK
Clock Cycle Time, CLKA or CLKB
15
Mhz
tCLKH
Pulse Duration, CLKA or CLKB HIGH
6
ns
tCLKL
Pulse Duration, CLKA or CLKB LOW
6
ns
tDS
Setup Time, A0-A35 before CLKA
↑ and B0-B35 before CLKB↑
4–
ns
tENS1
CSA, W/RA, before CLKA
↑; CSB, W/RB before CLKB↑
6–
ns
tENS2
ENA before CLKA
↑; ENB before CLKB↑
4–
ns
tENS3
MBA before CLKA
↑; ENB before CLKB↑
4–
ns
tPGS
Setup Time, ODD/EVEN and PGB before CLKB
(1)
4–
ns
tRSTS
Setup Time, RST LOW before CLKA
↑ or CLKB↑(2)
5–
ns
tFSS
Setup Time, FS0 and FS1 before RST HIGH
5
ns
tDH
Hold Time, A0-A35 after CLKA
↑ and B0-B35 after CLKB↑
1–
ns
tENH1
CSA, W/RA after CLKA
↑;CSB, W/RBafterCLKB↑
1–
ns
tENH2
ENA after CLKA
↑; ENB after CLKB↑
1ns
tENH3
MBA after CLKA
↑;MBBafterCLKB↑
1ns
tPGH
Hold Time, ODD/EVEN and PGB after CLKB
(1)
0–
ns
tRSTH
Hold Time, RST LOW after CLKA
↑ or CLKB↑(2)
6–
ns
tFSH
Hold Time, FS0 and FS1 after RST HIGH
4
ns
tSKEW1(3)
Skew Time, between CLKA
↑ and CLKB↑ for EF, FF
8–
ns
tSKEW2(3,4)
Skew Time, between CLKA
↑ and CLKB↑ for AE, AF
14
ns
NOTES:
1. Only applies for a rising edge of CLKB that does a FIFO read.
2. Requirement to count the clock edge as one of at least four needed to reset a FIFO.
3. Skew time is not a timing constraint for proper device operation and is only included to illustrate the timing relationship between CLKA cycle and CLKB cycle.
4. Design simulated, not tested.
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