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    參數(shù)資料
    

    


    


    
型號(hào)：
IBM25PPC750GXECR5H83T

    

    
元件分類：
微控制器/微處理器

    

    
英文描述：
32-BIT, 933 MHz, RISC PROCESSOR, CBGA292

    

    
封裝：
21 X 21 MM, 1 MM PITCH, LEAD FREE, CERAMIC, BGA-292

    

    
文件頁(yè)數(shù)：
60/74頁(yè)

    

    
文件大小：
1054K

    

    
代理商：
IBM25PPC750GXECR5H83T


    

    

    

	
    
    
    

    
    
	
    Datasheet
    IBM PowerPC 750GX RISC Microprocessor
    DD1.X
    750GX_ds_body.fm SA14-2765-02
    September 2, 2005
    System Design Information
    Page 63 of 73
    5.7.1 Thermal Assist Unit
    IBM recommends that the thermal assist unit (TAU) in these devices be calibrated before use. Calibration
    methods are discussed in the IBM application note, Calibrating the Thermal Assist Unit in the
    IBM25PPC750L Processors. Although this note was written for the 750L, the calibration methods discussed
    in this document also apply to the 750GX.
    5.7.2 Minimum Heat Sink Requirements
    The worst-case power dissipation (PD) for the 750GX is shown in Table 3-5, Power Consumption for DD1.1,
    on page 17. A conservative thermal management design will provide sufficient cooling to maintain the junc-
    tion temperature (TJ) of the 750GX below 105°C at maximum PD and worst-case ambient temperature and
    airflow conditions.
    Many factors affect the 750GX power dissipation, including VDD, TJ, core frequency, process factors, and the
    code that is running on the processor. In general, PD increases with increases in TJ, VDD, core frequency,
    process variables, and the number of instructions executed per second.
    For various reasons, a designer may determine that the power dissipation of the 750GX in their application
    will be less than the maximum value shown in this datasheet. Assuming a lower PD will result in a thermal
    management system with less cooling capacity than would be required for the maximum PD shown in the
    datasheet. In this case, the designer may decide to determine the actual maximum 750GX PD in the partic-
    ular application. Contact your IBM PowerPC field applications engineer for more information.
    In addition to the system factors that must be considered in a cooling system analysis, three things should be
    noted.
    Table 5-8. 750GX Heat-Sink Vendors
    Company Names and Addresses for Heat-Sink Vendors
    Chip Coolers, Inc.
    333 Strawberry Field Rd.
    Warwick, RI 02886
    (800) 227-0254
    International Electronic Research Corporation (IERC)
    413 North Moss Street
    Burbank, CA 91502
    (818) 842-7277
    Aavid Thermalloy
    80 Commercial Street
    Concord, NH 03301
    (603) 224-9888
    Wakefield Thermal Solutions Inc.
    33 Bridge Street
    Pellham, NH 03076
    (603) 635-2800
    
    
    
    
    
    


    


    

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    相關(guān)代理商/技術(shù)參數(shù)
    		

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IBM25PPC750GXECR6542T
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IBM25PPC750GXECR6582T
 制造商:IBM 功能描述:POLARIS 1.2 ?  21CBGA293    GR2 LIDLS ?  1GHZ - Trays 制造商:IBM 功能描述:IBMIBM25PPC750GXECR6582T MPU 21CBGA293

    

    
IBM25PPC750GXECR6582V
 制造商:IBM 功能描述:POLARIS 1.2 ?  21CBGA293    GR2 LIDLS ?  1GHZ - Trays

    

    
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 制造商:IBM 功能描述:POLARIS 1.2 ?  21CBGA293    GR2 LIDLS 1GHZ - Trays

    

    
    
    
    
	
    	
    
    
     
     
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