參數(shù)資料
型號(hào)： IBM25EMPPC750EBUB2330
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 233 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁(yè)數(shù)： 35/43頁(yè)
文件大?。?/td> 431K
代理商： IBM25EMPPC750EBUB2330
Preliminary and subject to change without notice
PPC740 and PPC750 Hardware Specifications
40 of 43
thermal resistance of the interface material (
θ
int) is typically about 1 °C/W. Assuming a
Ta of 30 °C,aTr of 5 °C, a CBGA package θjc = 0.03, and a power dissipation (Pd)of5.0
watts, the following expression for Tj is obtained:
Die-junction temperature: Tj = 30 °C + 5 °C + (0.03 °C/W +1.0 °C/W + θsa) * 5 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
sa)
versus air ow velocity is shown in Figure 22 .
Figure 22. . Thermalloy #2328B Pin-Fin Heat Sink-to-Ambient Thermal Resistance Versus Air flow
Velocity
Assuming an air velocity of 0.5 m/s, we have an effective
θ
sa of 7 °C/W, thus
Tj = 30°C + 5°C + (2.2 °C/W +1.0°C/W + 7 °C/W) * 4.5 W,
resulting in a junction temperature of approximately 81
°C which is well within the
maximum operating temperature of the component.
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Aavid, and Wakeeld
Engineering offer different heat sink-to-ambient thermal resistances, and may or may
not need air ow.
Though the junction-to-ambient and the heat sink-to-ambient thermal resistances are
a common gure-of-merit used for comparing the thermal performance of various
microelectronic packaging technologies, one should exercise caution when only using
this metric in determining thermal management because no single parameter can ade-
Approach Air Velocity (m/s)
Heat
Sink
Thermal
Resistance
(
°C/W)
1
2
3
4
5
6
7
8
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin-n Heat Sink
(25 x 28 x 15 mm)
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