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參數(shù)資料
| 型號： | HY62QF16200ALLF-I-10 |
| 廠商： | HYNIX SEMICONDUCTOR INC |
| 元件分類： | SRAM |
| 英文描述： | 128K X 16 STANDARD SRAM, 100 ns, PBGA48 |
| 封裝： | FINE PITCH, BGA-48 |
| 文件頁數(shù)： | 8/8頁 |
| 文件大?。?/td> | 143K |
| 代理商： | HY62QF16200ALLF-I-10 |
HY62QF16200A Series
Rev.04 /Jun. 2000
8
PACKAGE INFORMATION
48ball Fine Pitch Ball Grid Array Package(F)
BOTTOM VIEW
TOP VIEW
B
A
A1 CORNER
B1/2
INDEX AREA
6
5
4
3
2
1
A
B
C
D
C
C1
E
F
G
C1/2
H
B1/2
B1
SIDE VIEW
5
E1
E2
C
E
SEATING PLANE
4
A
r
3 D(DIAMETER)
Symbol
Min.
Typ.
Max.
A
-
0.75
-
B
-
3.75
-
B1
6.90
7.00
7.10
C
-
5.25
-
C1
7.90
8.00
8.10
D
0.3
0.35
0.4
E
-
1.10
E1
0.65
0.70
0.75
E2
0.17
0.22
0.27
R
-
0.12
Note
1. DIMENSIONING AND TOLERANCING PER ASME Y14. 5M-1994.
2. ALL DIMENSIONS ARE MILLIMETERS.
3. DIMENSION “ D” IS MEASURED AT THE MAXIMUM SOLDER
BALL DIAMETER IN A PLANE PARALLEL TO DATUM C.
4. PRIMARY DATUM C(SEATING PLANE) IS DEFINED BY THE
CROWN OF THE SOLDER BALLS.
5. THIS IS A CONTROLLING DIMENSION.
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